Roll-to-roll fabricated encapsulated semiconductor circuit devices
An encapsulated semiconductor device, comprising a first substrate having an electrically conductive surface; a second substrate having an electrically conductive pattern disposed thereon; and a pattern of semiconductor elements, each of the semiconductor elements having a first conductor and a second conductor. The encapsulated semiconductor device includes an adhesive having the pattern of semiconductor elements fixed thereto and disposed between the electrically conductive surface and the electrically conductive pattern to form a lamination, the adhesive being activatable to bind the second substrate to the first substrate so that one of the first conductor and the second conductor is automatically brought into and maintained in electrical communication with the electrically conductive pattern of the second substrate and so that the other of the first conductor and the second conductor of each semiconductor element is automatically brought into and maintained in electrical communication with the electrically conductive surface.
1. An encapsulated semiconductor device, comprising:
a first substrate having an electrically conductive surface;
a second substrate having an electrically conductive pattern disposed thereon;
a pattern of semiconductor elements, each of said semiconductor elements having a first conductor and a second conductor;
an adhesive having said pattern of semiconductor elements fixed thereto and disposed between said electrically conductive surface and said electrically conductive pattern to form a lamination, said adhesive being activatable to bind said second substrate to said first substrate so that one of said first conductor and said second conductor of at least one of said semiconductor elements is automatically brought into and maintained in electrical communication with said electrically conductive pattern of said second substrate and so that the other of said first conductor and said second conductor of each of said semiconductor elements is automatically brought into and maintained in electrical communication with said electrically conductive surface of said first substrate.
2. The encapsulated semiconductor device of claim 1 , said semiconductor elements further comprising:
a third conductor disposed between said first and second conductors; and
wherein said adhesive comprises at least one electrically conductive portion for making an electrical connection with said third conductor.
3. The encapsulated semiconductor device of claim 1 ;
wherein said first substrate, said second substrate and said adhesive are comprised of sheet material brought together from respective rolls in a continuous roll fabrication process.
4. The encapsulated semiconductor device of claim 1 ;
wherein said adhesive comprises a hotmelt material activatable by applying heat and pressure to said first and second substrates to soften said hotmelt material.
5. The encapsulated semiconductor device of claim 1 ;
wherein said adhesive comprises a sheet; and
wherein before forming the lamination, said pattern of semiconductor elements is embedded into said sheet.
6. The encapsulated semiconductor device of claim 5 , further comprising;
a transfer member; and
wherein said pattern of said semiconductor elements is formed by electrostatically attracting a plurality of said semiconductor elements on said transfer member and transferring said pattern of said semiconductor elements onto said adhesive.
7. The encapsulated semiconductor device of claim 5 further comprising;
a transfer member; and
wherein said pattern of said semiconductor elements is formed by magnetically attracting a plurality of said semiconductor elements on said transfer member and transferring said pattern of said semiconductor elements onto said adhesive.
8. The encapsulated semiconductor device of claim 5 ; wherein said pattern of said semiconductor elements is formable by a pick and place device.
9. The encapsulated semiconductor device of claim 5 ; wherein the pattern of semiconductor elements is formed by transferring said semiconductor elements from a lower tack adhesive to a relatively higher tack adhesive.