IP Library Granted Patent US 7,285,039
Granted Patent B1
US 7,285,039 · App. 11/543,761 · Granted Oct 23, 2007

Tools for polishing and associated methods

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Quick Facts
Patent No.
US 7,285,039
App. No.
11/543,761
Granted
Oct 23, 2007
Kind
B1
Abstract

Methods for making polishing tools and associated tools are disclosed. In one aspect, a method of making a polishing tool is provided. Such a method may include truing a working surface of a nano-diamond impregnated substrate. The method may further include forming asperities on the working surface with a polycrystalline diamond dresser, where the asperities have a height to distance ratio of from about 1:5 to about 5:1 and where the average asperity diameter is less than about 175 μm.

Claims (23)

1. A method of making a polishing tool comprising:

truing a working surface of a nano-diamond impregnated substrate;

forming asperities on the working surface with a polycrystalline diamond dresser, such that the asperities have a height to distance ratio of from about 1:5 to about 5:1, and wherein average asperity diameter is less than about 175 μm.

2. The method of claim 1 , wherein truing the working surface further includes shaving the working surface with a planer.

3. The method of claim 2 , wherein the planer is a polycrystalline diamond planer.

4. The method of claim 1 , wherein the height to distance ratio is from about 1:2 to about 2:1.

5. The method of claim 4 , wherein the height to distance ratio is about 1:1.

6. The method of claim 1 , wherein the average asperity diameter is less than about 150 μm.

7. The method of claim 6 , wherein the average asperity diameter is less than about 125 μm.

8. The method of claim 7 , wherein the average asperity diameter is less than about 100 μm.

9. The method of claim 1 , wherein the nano-diamond comprises less than about 50% of the substrate.

10. The method of claim 9 , wherein the nano-diamond comprises less than about 25% of the substrate.

11. The method of claim 10 , wherein the nano-diamond comprises less than about 10% of the substrate.

12. The method of claim 1 , wherein the nano-diamond impregnated substrate includes a member selected from the group consisting of organic materials, inorganic materials, and mixtures thereof.

13. The method of claim 12 , wherein the nano-diamond impregnated substrate includes an organic material.

14. The method of claim 13 , wherein the nano-diamond impregnated substrate includes the organic material selected from the group consisting of urethanes, carbonates, amides, sulfones, vinyl chlorides, acrylates, methacrylates, vinyl alcohols, esters, acrylamide moieties, and mixtures thereof.

15. The method of claim 12 , wherein the nano-diamond impregnated substrate includes an inorganic material.

16. The method of claim 13 , wherein the nano-diamond impregnated substrate includes the inorganic material selected from the group consisting of Al, Cu, Zn, Ga, In, Sn, Ge, Pb, Tl, Cd, Ag, Au, Ni, Pd, Pt, Co, Fe, Mn, W, Mo, Cr, Ta, Nb, V, Sr, Ti, Si, and mixtures thereof.

17. The method of claim 1 , further comprising disposing nano-abrasive particles within the working surface of the substrate.

18. The method of claim 17 , wherein the nano-abrasive particles include a member selected from the group consisting of diamond, boron carbide, cubic boron nitride, garnet, silica, ceria, alumina, zircon, zirconia, titania, manganese oxide, copper oxide, iron oxide, nickel oxide, silicon carbide, silicon nitride, tin oxide, titanium carbide, titanium nitride, tungsten carbide, yttria, and mixtures thereof.

19. The method of claim 1 , wherein the nano-diamond impregnated substrate is comprised of at least about 50% metal.

20. The method of claim 19 , wherein the nano-diamond impregnated substrate is comprised of at least about 75% metal.

21. The method of claim 1 , wherein the step of truing a working surface comprises obtaining a nano-diamond impregnated substrate that is pre-trued.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 18, 2021
From: SUNG, CHIEN-MIN
To: KINIK COMPANY
Reel/Frame 057217/0924 →
AGREEMENTS AFFECTING INTEREST Recorded Jul 29, 2013
From: SUNG, CHIEN-MIN, DR.
To: KINIK COMPANY
Reel/Frame 030919/0395 →