IP Library Patent Application 11549516
Patent Application
App. No. 11/549,516

POLARIZATION CONTROL IN VERTICAL CAVITY SURFACE EMITTING LASERS USING OFF-AXIS EPITAXY

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Quick Facts
Patent No.
US None
App. No.
11/549,516
Abstract

A polarization pinned long wavelength vertical cavity surface emitting laser (VCSEL). The VCSEL includes a III V semiconductor substrate. A bottom DBR mirror is formed on the semiconductor substrate. An active region is formed in an off-axis orientation on the bottom DBR mirror. The active region includes a surfactant that suppresses unwanted three dimensional growth. A top DBR mirror formed on the active region.

Claims (33)

1 . A method of fabricating a long wavelength VCSEL, the method comprising:

forming an off-axis orientation bottom DBR mirror on an off-axis orientation III V semiconductor substrate;

forming an active region on the off-axis orientation bottom DBR mirror, wherein forming an active region comprises forming the active region in an off-axis orientation using a surfactant to inhibit unwanted three dimensional growth; and

forming a top DBR mirror on the active region.

2 . The method of claim 1 , wherein the III V semiconductor substrate is GaAs.

3 . The method of claim 1 , wherein the surfactant is Antimony.

4 . The method of claim 1 , wherein forming an active region includes using about 1% Antimony and 2% Nitrogen.

5 . The method of claim 1 , wherein the acts recited are performed at a pressure of about 8×10 −8 torr SB beam equivalent pressure.

6 . The method of claim 1 , wherein forming an active region in an off-axis orientation comprises forming the active region in a 111 A or 111 B direction.

7 . The method of claim 1 , wherein forming an active region in an off-axis orientation comprises forming the active region in a 311 orientation.

8 . The method of claim 1 , wherein forming an active region in an off-axis orientation comprises forming the active region in a minimal off-axis orientation.

9 . The method of claim 1 , further comprising forming a layout asymmetry that includes a thermal asymmetry formed by a metal deposition pattern.

10 . The method of claim 1 , further comprising forming a layout asymmetry that includes a mechanical asymmetry formed by a trench pattern.

11 . The method of claim 1 , further comprising forming a layout asymmetry that includes an electrical asymmetry caused by a current injection method.

12 . The method of claim 1 , further comprising forming an an assembly by optically coupling a ¼ waveplate to the VCSEL.

13 . The method of claim 1 , wherein forming an active region comprises forming the active region in an off-axis orientation using migration enhanced epitaxy.

14 . The method of claim 1 , wherein forming an active region comprises using appropriate growth conditions to create sufficient step heights and densities to pin polarization.

15 . A long wavelength VCSEL comprising:

an off-axis orientation III V semiconductor substrate;

a bottom off-axis orientation DBR mirror formed on the off-axis orientation semiconductor substrate;

an active region formed in an off-axis orientation on the bottom DBR mirror, the active region comprising a surfactant that suppresses unwanted three dimensional growth; and

a top DBR mirror formed on the active region.

16 . The VCSEL of claim 15 wherein the III V semiconductor substrate is GaAs.

17 . The VCSEL of claim 15 , wherein the surfactant is Antimony.

18 . The VCSEL of claim 15 , the active region includes about 1% Antimony and 2% Nitrogen.

19 . The VCSEL of claim 15 , wherein the active region is in an off-axis orientation in a 111 A or 111 B direction.

20 . The VCSEL of claim 15 , wherein the active region in an off-axis orientation in a 311 orientation.

21 . The VCSEL of claim 15 , further comprising a thermal asymmetry formed by a metal deposition pattern.

22 . The VCSEL of claim 15 , further comprising a mechanical asymmetry formed by a trench pattern.

23 . The VCSEL of claim 15 , further comprising an electrical asymmetry caused by a current injection method.

24 . An optical assembly comprising:

a long wavelength VCSEL, wherein the VCSEL is fabricated in an off-axis orientation to pin polarization of the VCSEL, wherein the VCSEL comprises an active region, the active region comprising a surfactant to inhibit unwanted three dimensional growth cause by seeds in the active region that exist when the active region is formed in the off-axis orientation; and

a λ/4 waveplate optically coupled to the VCSEL and configured to cause light reflected back into the VCSEL to be orthogonal to the pinned polarization of the VCSEL.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 31, 2007
From: JOHNSON, RALPH H.
To: FINISAR CORPORATION
Reel/Frame 018832/0553 →