Electroless plating system

1. An electroless cobalt plating method comprising:

providing an initiation solution, the initiation solution containing reducing agents;

providing a plating solution, the plating solution containing reducing agents at a concentration which stabilizes the plating solution;

exposing a plating surface to the initiation solution;

after exposing the plating surface to the initiation solution, separately exposing the plating surface to the plating solution;

wherein a concentration of dissolved oxygen in the initiation solution and the plating solution is controlled to be below about four and a half parts per million; and

wherein the method provides for cobalt deposition over outlier features smaller than about five hundred nanometers and isolated by about one thousand nanometers, and the reducing agents in the initiation solution define a controlled concentration of reducing agents in the plating solution so as to stabilize the plating solution while also depositing over outlier features.

2. The method of claim 1 wherein the providing a plating solution includes bubbling an inert gas into the plating solution.

3. The method of claim 1 wherein the providing a plating solution includes humidifying an inert gas and introducing the humidified inert gas in the plating solution.

4. The method of claim 1 wherein the providing a plating solution includes replenishing de-ionized water in the plating solution.

5. An electroless cobalt plating method comprising:

providing an initiation solution, the initiation solution containing reducing agents;

providing a plating solution, the plating solution containing reducing agents at a concentration which stabilizes the plating solution;

exposing a plating surface to the initiation solution;

after exposing the plating surface to the initiation solution, separately exposing the plating surface to the plating solution;

wherein a concentration of dissolved oxygen in the initiation solution and the plating solution is controlled to be below about one part per million; and

plating a cobalt deposition layer over an outlier feature smaller than about five hundred nanometers and isolated by about one thousand nanometers of a semiconductor;

wherein the reducing agents in the initiation solution define a controlled concentration of reducing agents in the plating solution so as to stabilize the plating solution while also plating the cobalt deposition layer over an outlier feature.

6. The method of claim 5 wherein the providing an electroless plating solution includes bubbling nitrogen into the electroless plating solution.

7. The method of claim 5 wherein the providing an electroless plating solution includes humidifying nitrogen and introducing the humidified nitrogen in the electroless plating solution.

8. The method of claim 5 wherein the providing an electroless plating solution includes replenishing de-ionized water in the electroless plating solution without the need for a humidifier.

9. An electroless cobalt plating method comprising:

providing an initiation solution, the initiation solution containing reducing agents;

providing a plating solution, the plating solution containing reducing agents at a concentration which stabilizes the plating solution;

in an electroless plating chamber, exposing a plating surface to the initiation solution, and, after exposing the plating surface to the initiation solution, separately exposing the plating surface to the plating solution;

wherein a concentration of dissolved oxygen in the initiation solution and the plating solution is controlled to be below about four and a half parts per million;

wherein the method provides for cobalt deposition over outlier features smaller than about five hundred nanometers and isolated by about one thousand nanometers, and the reducing agents in the initiation solution define a controlled concentration of reducing agents in the plating solution so as to stabilize the plating solution while also depositing over outlier features.

10. The method of claim 9 wherein the providing a plating solution includes bubbling an inert gas into the plating solution.

11. The method of claim 9 wherein the providing a plating solution includes humidifying an inert gas and introducing the humidified inert gas in the plating solution.

12. The method of claim 9 wherein the providing a plating solution includes replenishing de-ionized water in the plating solution.