Composite receiver assembly having a circuit board on which multiple receiver devices that operate on different sets of wavelengths are mounted
View Patent ↗Multiple devices that operate at different wavelengths of light are incorporated into a single composite assembly to reduce the amount of space that is needed to incorporate the assembly into a consumer electronics device. In addition, by implementing the devices in a single composite assembly, costs associated with manufacturing, assembly and shipping the assembly can be reduced. The composite assembly includes filtering mechanisms that prevent undesired wavelengths of light from impinging on the devices.
1. A composite assembly comprising:
a circuit board having a cup-shaped opening formed therein;
a first receiver device mounted on the circuit board inside of the cup-shaped opening, the first receiver device operating on a first set of wavelengths of light, the first receiver device having electrical connections that are connected to conductors of the circuit board;
a second receiver device mounted on the circuit board, the second receiver device operating on a second set of wavelengths of light, the second receiver device having electrical connections that are connected to conductors of the circuit board;
a first filter device disposed at least partially inside of the cup-shaped opening, the first filter device passing light of the first set of wavelengths and filtering out light of other wavelengths such that only light of the first set of wavelengths passes through the first filter device and impinges on the first device; and
a second filter device disposed on the assembly, the second filter device passing light of the second set of wavelengths and filtering out light of other wavelengths such that only light of the second set of wavelengths passes through the second filter device and impinges on the second device, and wherein the wavelengths of the first set of wavelengths are different from the wavelengths of the second set of wavelengths.
2. The composite assembly of claim 1 , wherein the first receiver device includes an infrared (IR) photodiode integrated circuit (IC), the first set of wavelengths being IR wavelengths.
3. The composite assembly of claim 2 , wherein the first filter device is an IR epoxy.
4. The composite assembly of claim 1 , wherein said second receiver device includes an ambient light photosensor (ALPS) integrated circuit (IC), and wherein the second wavelengths of light are visible-light wavelengths, and wherein the second filter device is a visible-light pass filter located on the ALPS IC such that only visible light impinges on the ALPS IC.
5. The composite assembly of claim 4 , further comprising a transparent epoxy covering said first and second receiver devices and said first and second filter devices.
6. The composite assembly of claim 4 , wherein the composite assembly is less than approximately 10 millimeters (mm) in width, 4 mm in length and 5 mm in height.
7. A method for making a composite assembly that includes multiple devices that operate at different wavelengths, the method comprising:
forming a cup-shaped opening in a circuit board;
attaching a first IC to the circuit board inside of the cup-shaped opening, the first IC operating on a first set of wavelengths of light;
attaching a second IC to the circuit board, the second IC operating on a second set of wavelengths of light;
performing a wire-bonding process to bond conductors of the first and second ICs to conductors of the circuit board;
disposing a first filter device in the cup-shaped opening, the first filter device passing light of the first set of wavelengths and preventing light of other wavelengths from passing through the first filter device and impinging on the first IC; and
disposing a second filter device on the assembly, the second filter device passing light of the second set of wavelengths and preventing light of other wavelengths from passing through the second filter device and impinging on the second IC, wherein the wavelengths of the first set of wavelengths are different from the wavelengths of the second set of wavelengths.
8. The method of claim 7 , wherein the first IC includes an infrared (IR) photodiode IC, the wavelengths of the first set of wavelengths being IR wavelengths.
9. The method of claim 8 , wherein the first filter device is an IR epoxy, the method including the step of curing the IR epoxy after disposing the IR epoxy in the cup-shaped opening.
10. The method of claim 9 , wherein the second IC is an ambient light photosensor (ALPS) IC of an ALPS device, and wherein said second filter device is a visible-light pass filter, and wherein the wavelengths of the second set of wavelengths are visible-light wavelengths, and wherein the visible-light pass filter is located on the assembly such that only visible light passes through the visible-light pass filter and impinges on the ALPS IC.
11. The method of claim 10 , further comprising:
applying a transparent epoxy to the assembly that covers the first and second ICs and the first and second filter devices.
12. The method of claim 7 , wherein the composite assembly is less than approximately 10 millimeters (mm) in width, 4 mm in length and 5 mm in height.
13. The method of claim 10 , wherein the visible-light pass filter is a pre-coating material that is applied to the second IC prior to attaching the second IC to the circuit board.
14. The method of claim 13 , wherein the first IC is an IR photodiode IC of a remote control (RC) receiver device.