Remote control receiver device and ambient light photosensor device incorporated into a single composite assembly
View Patent ↗An RC receiver device and an ambient light photosensor (ALPS) device are mounted on a single mounting device (e.g., circuit board or lead frame substrate) such that they are part of a single composite assembly. This reduces the amount of space that is consumed in electronic devices in which the assemblies are installed, which allows the electronic devices to be made smaller in size. In addition, implementing both the RC receiver device and the ALPS device in a single composite assembly lowers costs associated with manufacturing, assembling and shipping the composite assembly.
1. A composite assembly comprising:
a mounting device having a first output port and a second output port for communicating with an external electronic device;
a remote control (RC) receiver device mounted on the mounting device, the RC receiver device comprising an RC receiver integrated circuit (IC) and an infrared (IR) photodiode IC, the RC receiver IC having electrical connections that are connected to conductors of the mounting device, wherein one of the electrical connections provides a first output signal to the first output port of the mounting device, the IR photodiode IC being disposed in a cup formed in a surface of the mounting device;
an ambient light photosensor (ALPS) device mounted on the mounting device, the ALPS device comprising a photosensor IC, the ALPS photosensor IC having electrical connections that are connected to conductors of the mounting device, one of the electrical connections of the ALPS photosensor IC for providing a second output signal to the second output port of the mounting device; and
an IR light pass filter disposed at least partially in the cup and covering at least a light-receiving surface of the IR photodiode IC to allow IR light to pass through the filter and impinge on the light-receiving surface of the IR photodiode IC while preventing other wavelengths of light from impinging on the light-receiving surface of the IR photodiode IC; and
a visible light pass filter disposed at least on a light-receiving surface of the ALPS photosensor IC to allow visible light to pass through the visible light pass filter and impinge on the light-receiving surface of the ALPS photosensor IC while preventing non-visible wavelengths of light from impinging on the light-receiving surface of the ALPS photosensor IC.
2. The composite assembly of claim 1 , wherein the RC receiver IC and the IR photodiode IC are integrated into a single die.
3. The composite assembly of claim 1 , wherein the RC receiver device further comprises processing circuitry for processing electrical signals produced by the IR photodiode, and wherein said electrical connections of the RC receiver device correspond to pins of the RC receiver IC, said electrical connections of the ALPS photosensor IC corresponding to pins of the ALPS photosensor IC.
4. The composite assembly of claim 1 , wherein the IR pass filter is an IR epoxy.
5. The composite assembly of claim 4 , further comprising:
a transparent epoxy that covers at least a portion of the mounting device on which the ICs are mounted.
6. A method for making a composite assembly comprising:
providing a mounting device having a first output port and a second output port for communicating with an external electronic device, the mounting device having a cup formed in a surface thereof;
mounting a remote control (RC) receiver device on the mounting device, the RC receiver device comprising an RC receiver integrated circuit (IC) and an infrared (IR) photodiode IC, at least a portion of the IR photodiode being inside of the cup;
connecting electrical connections of the RC receiver device to conductors of the mounting device, one of the electrical connections being connected to the first output port;
mounting an ambient light photosensor (ALPS) device on the mounting device the ALPS device comprising an ALPS photosensor IC;
connecting electrical connections of the ALPS device to conductors of the mounting device, one of the electrical connections being connected to the second output port;
placing an IR light pass filter in the cup such that the filter covers at least a light-receiving surface of the IR photodiode IC, the IR light pass filter allowing IR light to pass through the IR light pass filter and impinge on the light-receiving surface of the IR photodiode IC while preventing other wavelengths of light from impinging on the light-receiving surface of the IR photodiode IC; and
placing a visible light pass filter on the ALPS device such that the visible light pass filter covers at least a light-receiving surface of the ALPS photosensor IC, the visible light pass filter allowing visible light to pass through the visible light pass filter and impinge on the light-receiving surface of the ALPS photosensor IC while preventing non-visible light from passing through the visible light pass filter and impinging on the light-receiving surface of the ALPS photosensor IC.
7. The method of claim 6 , wherein said electrical connections of the RC receiver device correspond to pins of the RC receiver IC, and wherein said electrical connections of the ALPS photosensor IC correspond to pins of the ALPS photosensor IC, and wherein at least one pin of the IR photodiode IC is electrically connected to at least one pin of the RC receiver IC, and wherein pins of the RC receiver IC and pins of the ALPS photosensor IC are electrically connected to conductors of the mounting device.
8. The method of claim 6 , wherein the RC receiver IC and the IR photodiode are integrated into a single die.
9. The method of claim 6 , wherein the cup is formed in the surface of the mounting device
prior to mounting the RC receiver and ALPS devices on the mounting device, and wherein the IR light pass filter is an IR epoxy that is dispensed into the cup.
10. The method of claim 6 , wherein the IR light pass filter is an IR light pass filter coating disposed at least on the light-receiving surface of the IR photodiode.