IP Library Granted Patent US 7,395,719
Granted Patent B2
US 7,395,719 · App. 11/552,064 · Granted Jul 8, 2008

Preformed sensor housings and methods to produce thin metal diaphragms

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Quick Facts
Patent No.
US 7,395,719
App. No.
11/552,064
Granted
Jul 8, 2008
Kind
B2
Abstract

A preformed sensor housing including a conduit having an inside; a plug disposed within the conduit; and a deposit covering a portion of the plug and a portion of the conduit. A method is also disclosed for creating a thin film diaphragm on a housing including the step of inserting a sacrificial element into the housing; depositing a diaphragm material onto the sacrificial element and the housing; and removing the sacrificial element.

Claims (24)

1. A sensor tip assembly comprising:

a housing having an interior;

a sacrificial element disposed in the housing, wherein a first portion of the sacrificial element is disposed in the housing interior and a second portion of the sacrificial element extends outside of the housing, wherein the second portion has a shaped surface; and

a diaphragm attached to the housing and attached to the second portion of the sacrificial element, the diaphragm including a side wall portion, the side wall portion of the diaphragm comprising a patterned surface that is formed on the shaped surface of the sacrificial element.

2. The sensor tip assembly of claim 1 , wherein the diaphragm is hermetically attached to the housing.

3. The sensor tip assembly of claim 2 , wherein the corrugated pattern comprises a plurality of parallel rings.

4. The sensor tip assembly of claim 1 , wherein the diaphragm further includes a front face portion having a second patterned surface.

5. The sensor tip assembly of claim 4 , wherein the second patterned surface comprises a flat surface.

6. The sensor tip assembly of claim 4 , wherein the second patterned surface comprises a corrugated surface.

7. The sensor tip assembly of claim 4 , wherein the second patterned surface comprises a regularly patterned surface.

8. The sensor tip assembly of claim 1 , wherein the diaphragm comprises a chamber.

9. The sensor tip assembly of claim 8 , wherein the chamber is expandable.

10. The sensor tip assembly of claim 8 , wherein the chamber is compressible.

11. The sensor tip assembly of claim 1 , wherein the patterned surface of the diaphragm comprises a corrugated pattern.

12. A method comprising:

providing a housing having an interior and an opening therein;

inserting a plug in the housing such that a first portion of the plug is inside the housing and a second portion of the plug extends through the opening and outside the housing;

forming a cover over the second portion of the plug and at least a portion of the housing, the cover attached to the housing and the second portion of the plug; and

removing the entire plug, whereby the cover is still attached to the housing, thereby forming a chamber.

13. The method of claim 12 , further comprising removing the plug comprises removing the plug using a chemical.

14. The method of claim 12 , wherein the step of removing the plug comprises removing the plug using a change in temperature.

15. The method of claim 12 , further comprising creating a pattern on the plug.

16. The method of claim 15 , wherein creating a pattern on the plug comprises creating a plurality of ridges on the plug.

17. The method of claim 15 , wherein creating a pattern on the plug comprises forming a textured surface on at least a portion of the plug.

Assignments (4)
SECURITY INTEREST Recorded Feb 25, 2016
From: BEI NORTH AMERICA LLC; CRYDOM, INC.; CUSTOM SENSORS & TECHNOLOGIES, INC.; KAVLICO CORPORATION
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037927/0605 →
RELEASE OF SECURITY INTEREST Recorded Dec 2, 2015
From: DEUTSCHE BANK AG NEW YORK BRANCH
To: BEI SENSORS & SYSTEMS COMPANY, INC.; CUSTOM SENSORS & TECHNOLOGIES, INC.; CRYDOM, INC.; BEI TECHNOLOGIES, INC.; KAVLICO CORPORATION
Reel/Frame 037196/0174 →
SECURITY AGREEMENT Recorded Oct 3, 2014
From: BEI SENSORS & SYSTEMS COMPANY, INC.; CUSTOM SENSORS & TECHNOLOGIES, INC; CRYDOM, INC.; BEI TECHNOLOGIES, INC.; KAVLICO CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 033888/0700 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 23, 2006
From: NASSAR, MARCOS; MCDANIEL, SCOTT
To: KAVLICO CORPORATION
Reel/Frame 018425/0005 →