IP Library Granted Patent US 7,352,270
Granted Patent B1
US 7,352,270 · App. 11/553,502 · Granted Apr 1, 2008

Printed circuit board with magnetic assembly

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Quick Facts
Patent No.
US 7,352,270
App. No.
11/553,502
Granted
Apr 1, 2008
Kind
B1
Abstract

A magnetic assembly including a printed circuit board and a core made from magnetically permeable material positioned on the printed circuit board. Plated through holes are formed in the printed circuit board, a first plated through hole on a first side of the core, a second plated through on a second side of the core and third plated though hole on the first side of the core. A winding lead has a first leg soldered in the first plated through hole and a second leg soldered in the second plated through hole, the winding lead being a discrete electrical conductor separate from the printed circuit board. A conductive trace is formed in the printed circuit board, the conductive trace electrically connected the second plated through hole and the third plated through hole.

Claims (15)

1. A magnetic assembly comprising:

a printed circuit board;

a core made from magnetically permeable material positioned on the printed circuit board;

plated through holes formed in the printed circuit board, a first plated through hole on a first side of the core, a second plated through hole on a second side of the core and third plated through hole on the first side of the core;

a winding lead having a first leg soldered in the first plated through hole and a second leg soldered in the second plated through hole, the winding lead being a discrete electrical conductor separate from the printed circuit board, the first leg extending through and beyond the printed circuit board opposite the core and the second leg extending through and beyond the printed circuit board opposite the core;

a conductive trace formed in the printed circuit board, the conductive trace electrically connecting the second plated through hole and the third plated through hole; and

a heat sink positioned on the printed circuit board opposite the core, the heat sink including a first recessed channel for receiving the first leg extending beyond the printed circuit board opposite the core, the heat sink including a second recessed channel for receiving the second leg extending beyond the printed circuit board opposite the core.

2. The magnetic assembly of claim 1 further comprising:

a plurality of winding leads and a plurality of conductive traces, the winding leads and conductive traces forming a winding encompassing the core.

3. The magnetic assembly of claim 1 further comprising:

a spacer positioned between the printed circuit board and the core.

4. The magnetic assembly of claim 1 further comprising:

a spacer positioned between the winding lead and the core.

5. The magnetic assembly of claim 1 further comprising:

a plurality of thermal vias in the printed circuit board, the thermal vias conducting heat from the core to the heat sink.

Assignments (3)
MERGER Recorded Jul 1, 2016
From: EXELIS INC.
To: HARRIS CORPORATION
Reel/Frame 039362/0534 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 17, 2012
From: ITT MANUFACTURING ENTERPRISES LLC; ITT CORPORATION
To: EXELIS INC.
Reel/Frame 027542/0683 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 27, 2006
From: COPELAND, CURTIS S.
To: ITT MANUFACTURING ENTERPRISES,INC.
Reel/Frame 018444/0507 →