IP Library Granted Patent US 7,524,560
Granted Patent B2
US 7,524,560 · App. 11/554,005 · Granted Apr 28, 2009

Enhanced boron nitride composition and compositions made therewith

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,524,560
App. No.
11/554,005
Granted
Apr 28, 2009
Kind
B2
Abstract

A boron nitride composition having its surface treated with a coating layer comprising at least one of a silane, a siloxane, a carboxylic derivative, and mixtures thereof, wherein the coating layer adheres to at least 10% of the surface of the boron nitride. The boron nitride powder surface is first treated by either a calcination process, or by coating with at least an inorganic compound for the surface to have a plurality of reactive sites containing at least a functional group that is reactive to at least one functional group of the final coating layer.

Claims (30)

1. A boron nitride composition comprising boron nitride powder, the boron nitride powder having its surface treated with at least an over-coating layer comprising at least one of a silane, a siloxane, a carboxylic derivative, and mixtures thereof, the over-coating layer having at least a reactive one functional group, wherein the over-coating layer adheres to at least 2% of the surface of the boron nitride, wherein the boron nitride powder prior to being treated with the over-coating layer, is first calcined and/or treated to form a plurality of reactive sites on its surface containing at least a functional group that is reactive to at least one functional group of the over-coating layer.

2. The boron nitride composition of claim 1 , wherein the boron nitride powder is first calcined at a temperature between 200 and 1000°C for 0.5 to 24 hours in an oxidizing environment.

3. The boron nitride composition of claim 2 , wherein the boron nitride powder is first calcined at a sufficient temperature for a sufficient amount of time for the boron nitride powder to have an oxygen concentration of at least 2%.

4. The boron nitride composition of claim 1 , wherein the boron nitride powder is first treated by coating the boron nitride powder with at least one inorganic or organometallic compound for the surface to have a plurality of reactive sites containing at least a functional group that is reactive to at least one functional group of the final coating layer.

5. The boron nitride composition of claim 4 , wherein the boron nitride powder is first treated by coating the boron nitride powder with an inorganic compound.

6. The boron nitride composition of claim 5 , wherein the boron nitride powder is first treated by coating the boron nitride powder with at least one of a refractory metal oxide and hydroxide.

7. The boron nitride composition of claim 4 , wherein boron nitride powder is first treated by coating the boron nitride powder with 0.5 to about 10 wt. % of an inorganic compound selected from the group of refractory metal oxides and hydroxides.

8. The boron nitride composition of claim 4 , wherein the boron nitride powder is first treated by coating the boron nitride powder with at least an organometallic compound.

9. The boron nitride composition of claim 4 , wherein the boron nitride powder is first treated by coating the boron nitride powder with at least an organometallic compound or a metallic compound, and heated to a sufficient temperature for the organometallic or the metallic compound to be converted to at least one of alumina, silica, zirconia, boria, titania, ceria, germania, tantalum oxide, cesia, yttria, magnesia, thoria, and mixtures thereof.

10. The boron nitride composition of claim 4 , wherein the boron nitride powder is first treated by coating the boron nitride powder with at least one of: nickel acetate, nickel sulfate, nickel nitrate, copper acetate, copper sulfate, copper nitrate, zinc acetate, zinc is sulfate, zinc nitrate, strontium acetate, strontium sulfate, strontium nitrate, aluminum sulfate, aluminum propoxide, aluminum silicate, sodium aluminate, aluminum acetate and mixtures thereof.

11. The boron nitride composition of claim 4 , wherein the boron nitride powder is first treated by coating the boron nitride powder with a composition comprising colloidal silica having an average particle size ranging from 20 to 100 nm.

12. The boron nitride composition of claim 4 , wherein the boron nitride powder is first treated by coating the boron nitride powder with a composition comprising at least one of sorbitan monostearate, sorbitan monolaurate, sorbitan monoleate, sorbitan monopalmate, polyoxyethylene sorbitan monolaurate, polyoxyethylene sorbitan monostearate, polyoxyethylene sorbitan monooleate, polyoxyethylene sorbitan monopalmate, and polyoxyethylene sorbitan tristearate, and mixtures thereof.

13. The boron nitride composition of claim 1 , wherein the over coating layer comprises one of a polyparahydroxy benzoic acid and undecyloxybenzoic acid.

14. The boron nitride composition of claim 1 , wherein the over coating layer comprises a compound selected from the group of functionalized silanes, disilanes, trisilanes, oligomeric silanes, polymeric silanes, and combinations thereof.

15. The boron nitride composition of claim 14 , wherein the functionalized silane comprises at least one functional group selected from amine, carboxylic acid, anhydride, phosphonic acid, pyridinyl, hydroxyl, epoxy, thioisocyanate, blocked polythioisocyanate, amide, carbamate, maleimide, fumarate, onium salt, hydroxy alkylamide, half-ester acid group and salts, and combinations thereof.

16. The boron nitride composition of claim 1 , wherein the boron nitride powder comprises platelets having an average particle size of at least 50 pm.

17. The boron nitride composition of claim 1 , wherein the boron nitride powder comprises platelets having an average particle size of ranging from 10 to 300 pm.

18. The boron nitride composition of claim 17 , wherein the boron nitride powder comprises platelets having an average particle size of ranging from 10 to 100 pm.

19. The boron nitride composition of claim 1 , wherein the boron nitride powder comprises spherically shaped agglomerates of irregular non-spherical particles bound together by a binder and subsequently spray-dried.

20. The boron nitride composition of claim 1 , wherein the boron nitride powder comprises hexagonal boron nitride platelets having an aspect ratio of from about 50 to about 300.

21. The boron nitride composition of claim 20 , wherein the boron nitride powder comprises hexagonal boron nitride platelets having an aspect ratio of from about 50 to about 100.

22. The boron nitride composition of claim 1 , wherein the boron nitride powder comprises irregularly shaped agglomerates of hexagonal boron nitride platelets, having an average particle size of above 10 microns.

23. An article comprising the boron nitride composition of claim 1 .

24. A polymer composite comprising a polymer matrix selected from the group of a melt-processable polymers, polyesters, phenolics, silicone polymers, acrylics, waxes, thermoplastic polymers, low molecular weight fluids, and epoxy molding compounds, and mixtures thereof, and a filler material comprising particles of boron nitride, the boron nitride having its surface treated with at least an coating compound comprising at least one of a silane, a siloxane, a carboxylic derivative, and mixtures thereof, and wherein the coating compound adheres to at least 10% of the surface of the boron nitride.

25. The polymer composite of claim 24 , wherein the polymer matrix comprises a silicone resin.

26. The polymer composite of claim 24 , wherein the polymer matrix comprises at least one of a liquid crystal polymer; a polyester such as polyethylene naphthalate, polyethylene terephthalate, polybutylene terephthalate; a polyamide; a polyimide; a polyphthalamide; a polyphenylene sulfide; a polycarbonate; a polyetheretherketone; apolyaryletherketone; a polyphenylene oxide; and a mixture thereof.

27. A method for producing boron nitride powder, comprising the steps of: introducing a plurality of reactive sites on at least a portion of the boron nitride surface; coating the boron nitride with at a coating layer comprising a compound selected from at least one of a silane, a siloxane, a carboxylic derivative, and mixtures thereof, the coating compound contains has at least a reactive functional group; wherein the coating layer adheres to at least 10% of the surface of the boron nitride surface.

28. The method of claim 27 , wherein the reactive sites are introduced on at least a portion of the boron nitride surface by: calcining the boron nitride at a temperature between 200 and 10000 C for 0.5 to 24 hours in an oxidizing environment.

29. The method of claim 27 , wherein the reactive sites are introduced on at least a portion of the boron nitride surface by: calcining the boron nitride at a sufficient temperature for a sufficient amount of time for the boron nitride powder to have an oxygen concentration of at least 2%.

30. The method of claim 27 , wherein the reactive sites are introduced on at least a portion of the boron nitride surface by: coating the boron nitride powder with at least an inorganic compound or a metallic compound, and heating the coated boron powder to a sufficient temperature for the organometallic or the metallic compound to be converted to at least one of alumina, silica, zirconia, boria, titania, ceria, germania, tantalum oxide, cesia, yttria, magnesia, thoria, and mixtures thereof.

Assignments (25)
PATENT SECURITY AGREEMENT Recorded May 23, 2025
From: MOMENTIVE PERFORMANCE MATERIALS QUARTZ, INC.
To: STANDARD CHARTERED BANK, AS COLLATERAL AGENT AND ADMINISTRATIVE AGENT
Reel/Frame 071368/0854 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Mar 31, 2023
From: BNP PARIBAS
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 063259/0133 →
RELEASE OF SECURITY INTEREST Recorded Mar 30, 2023
From: KOOKMIN BANK NEW YORK
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 063197/0373 →
NUNC PRO TUNC ASSIGNMENT Recorded Feb 4, 2021
From: MOMENTIVE PERFORMANCE MATERIALS INC.
To: MOMENTIVE PERFORMANCE MATERIALS QUARTZ, INC.
Reel/Frame 055222/0140 →
RELEASE OF SECURITY INTEREST Recorded Dec 24, 2020
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 054883/0855 →
RELEASE OF SECURITY INTEREST Recorded Nov 11, 2020
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: MOMENTIVE PERFORMANCE MATERIALS INC.; MOMENTIVE PERFORMANCE MATERIALS GMBH & CO KG; MOMENTIVE PERFORMANCE MATERIALS JAPAN HOLDINGS GK
Reel/Frame 054387/0001 →
ABL PATENT AGREEMENT Recorded Jun 5, 2019
From: MOMENTIVE PERFORMANCE MATERIALS INC.; MOMENTIVE PERFORMANCE MATERIALS GMBH
To: CITIBANK, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 049388/0252 →
FIRST LIEN TERM LOAN PATENT AGREEMENT Recorded Jun 5, 2019
From: MOMENTIVE PERFORMANCE MATERIALS INC.
To: BNP PARIBAS, AS ADMINISTRATIVE AGENT
Reel/Frame 049387/0782 →
SECOND LIEN TERM LOAN PATENT AGREEMENT Recorded Jun 5, 2019
From: MOMENTIVE PERFORMANCE MATERIALS INC.
To: KOOKMIN BANK, NEW YORK BRANCH, AS ADMINISTRATIVE AGENT
Reel/Frame 049388/0220 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded May 21, 2019
From: JPMORGAN CHASE BANK, N.A.
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 050304/0555 →
RELEASE OF SECURITY INTEREST Recorded May 15, 2019
From: BOKF, NA
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 049194/0085 →
RELEASE OF SECURITY INTEREST Recorded May 15, 2019
From: BOKF, NA
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 049249/0271 →
NOTICE OF CHANGE OF COLLATERAL AGENT - ASSIGNMENT OF SECURITY INTEREST IN INTELLECTUAL PROPERTY - SECOND LIEN Recorded Mar 6, 2015
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A. AS COLLATERAL AGENT
To: BOKF, NA, AS SUCCESSOR COLLATERAL AGENT
Reel/Frame 035137/0263 →
NOTICE OF CHANGE OF COLLATERAL AGENT - ASSIGNMENT OF SECURITY INTEREST IN INTELLECTUAL PROPERTY Recorded Mar 6, 2015
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A. AS COLLATERAL AGENT
To: BOKF, NA, AS SUCCESSOR COLLATERAL AGENT
Reel/Frame 035136/0457 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS Recorded Oct 30, 2014
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 034113/0331 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS Recorded Oct 30, 2014
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 034113/0252 →
SECURITY INTEREST Recorded Oct 27, 2014
From: MOMENTIVE PERFORMANCE MATERIALS INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 034066/0570 →
SECURITY INTEREST Recorded Oct 27, 2014
From: MOMENTIVE PERFORMANCE MATERIALS INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 034066/0662 →
SECURITY AGREEMENT Recorded Apr 29, 2013
From: MOMENTIVE PERFORMANCE MATERIALS INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 030311/0343 →
PATENT SECURITY AGREEMENT Recorded Apr 3, 2013
From: MOMENTIVE PERFORMANCE MATERIALS INC.
To: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., THE
Reel/Frame 030185/0001 →
SECURITY AGREEMENT Recorded May 31, 2012
From: MOMENTIVE PERFORMANCE MATERIALS INC
To: BANK OF NEW YORK MELLON TRUST COMPANY, N.A., THE
Reel/Frame 028344/0208 →
SECURITY AGREEMENT Recorded Jul 1, 2009
From: MOMENTIVE PERFORMANCE MATERIALS, INC.; JUNIPER BOND HOLDINGS I LLC; JUNIPER BOND HOLDINGS II LLC; JUNIPER BOND HOLDINGS III LLC; JUNIPER BOND HOLDINGS IV LLC; MOMENTIVE PERFORMANCE MATERIALS CHINA SPV INC.; MOMENTIVE PERFORMANCE MATERIALS QUARTZ, INC.; MOMENTIVE PERFORMANCE MATERIALS SOUTH AMERICA INC.; MOMENTIVE PERFORMANCE MATERIALS USA INC.; MOMENTIVE PERFORMANCE MATERIALS WORLDWIDE INC.; MPM SILICONES, LLC
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL TRUSTEE
Reel/Frame 022902/0461 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 3, 2009
From: GENERAL ELECTRIC COMPANY
To: MOMENTIVE PERFORMANCE MATERIALS INC.
Reel/Frame 022338/0184 →
SECURITY AGREEMENT Recorded Jul 3, 2007
From: MOMENTIVE PERFORMANCE MATERIALS HOLDINGS INC.; MOMENTIVE PERFORMANCE MATERIALS GMBH & CO. KG; MOMENTIVE PERFORMANCE MATERIALS JAPAN HOLDINGS GK
To: JPMORGAN CHASE BANK, N.A. AS ADMINISTRATIVE AGENT
Reel/Frame 019511/0166 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 28, 2006
From: PAISNER, SARA N; HANS, PAUL JOSEPH; MENEGHETTI, PAULO
To: GENERAL ELECTRIC COMPANY
Reel/Frame 018449/0060 →