Power controller with fusible link

1. A power control system, comprising:

a device having an output;

a fusible link coupled to the output of the device;

a heating element controller; and

at least one heating element coupled to the heating element controller, where the heating element controller is configured to control the flow of current through the heating element;

wherein the heating element controller is configured to monitor activity of the device;

wherein the heating element is configured to generate sufficient heat to fuse the fusible link within a predetermined time period when current flows through the heating element;

wherein the fusible link comprises a circuit trace;

wherein the heating element comprises a circuit trace having a repeating pattern comprising a first section and a second section connected perpendicular to the first section; and

wherein the heating element is configured to concentrate the generated heat on the fusible link.

2. The power control system of claim 1 , wherein the fusible link is connected to the heating element controller.

3. The power control system of claim 2 , wherein the heating element controller is configured to control the flow of current from the fusible link to the at least one heating element.

4. The power control system of claim 3 , wherein the heating element controller is configured to measure a current flowing from the device to the fusible link.

5. The power control system of claim 1 , wherein the device is a field effect transistor.

6. The power control system of claim 1 , wherein the heating element controller includes a microprocessor.

7. The power control system of claim 1 , wherein at least one heating element is proximate the fusible link.

8. The power control system of claim 1 , wherein the device is an electromechanical device.

9. The power control system of claim 8 , wherein the electromechanical device is a relay or a contactor.

10. The power control system of claim 1 , further comprising:

a power source connected to the heating element controller;

wherein the heating element controller is configured to control the flow of current from the power source to the at least one heating element.

11. The power control system of claim 1 :

wherein the heating element is disposed on a first layer; and

wherein the fusible link is disposed on a second layer adjacent to the first layer.

12. The power control system of claim 11 , further comprising:

a second heating element disposed on a third layer;

wherein the second layer is disposed between the first layer and the third layer.

13. The power control system of claim 11 , wherein the repeating pattern of the heating element crosses a projection of the fusible link circuit trace onto the second layer at a plurality of locations along the projection.

14. The power control system of claim 1 , wherein the repeating pattern comprises a shape configured to maximize the generated heat to be transferred to the fusible link.

15. The power control system of claim 1 , wherein the repeating pattern is positioned to maximize the generated heat to be transferred to the fusible link.

16. A power control system, comprising:

a microprocessor coupled to a first switching device and a sensor circuit;

a heating element coupled to the first switching device;

a second switching device coupled to the sensor circuit;

a fusible link coupled to the second switching device and the first switching device; and

a load coupled to the fusible link;

wherein the sensor circuit is configured to monitor a connection between the second switching device and the fusible link;

wherein the fusible link comprises a circuit trace;

wherein the heating element comprises a circuit trace having a repeating pattern comprising a first section and a second section connected perpendicular to the first section; and

wherein the heating element is configured to concentrate the generated heat on the fusible link.

17. The power control system of claim 16 , wherein:

the microprocessor is configured to monitor the state of the second switching device and measure a current flowing from the second switching device to the fusible link using at least the sensor circuit;

the microprocessor is configured to control the first switching device;

the first switch device is configured to control the current flow through the heating element; and

the heating element is proximate the fusible link.

18. The power control system of claim 17 , wherein the microprocessor and the second switching device are components of a solid state power controller.

19. The power control system of claim 17 , wherein the second switching device is a field effect transistor.

20. The power control system of claim 17 , wherein the second switching device is an electromechanical device.

21. The power control system of claim 20 , wherein the electromechanical device is a relay or a contactor.

22. The power control system of claim 19 , wherein the second switching device and the microprocessor are components of a solid state power controller.

23. The power control system of claim 16 , wherein the fusible link and heating element circuit traces are formed on a printed wiring board.

24. The power control system of claim 23 , wherein the heating element circuit trace comprises vertical segments and horizontal segments and two ends.

25. The power control system of claim 24 , wherein:

the vertical segments are equal in length;

the horizontal segments are equal in length;

adjacent vertical segments and horizontal segments are perpendicular to one another and are connected to each other; and

the fusible link circuit trace and vertical segments run perpendicular to each other.

26. The power control system of claim 24 , wherein the vertical segments are longer than the horizontal segments.

27. The power control system of claim 23 , wherein the printed circuit board comprises a dielectric layer that includes FR-4.

28. The power control system of claim 23 , wherein the printed circuit board comprises a dielectric layer that includes Kapton.

29. The power control system of claim 23 , further comprising:

a second heating element comprising a circuit trace having a repeating pattern comprising a first section and a second section connected perpendicular to the first section;

wherein the heating element is disposed on a first layer of the printed wiring board;

wherein the fusible link is disposed on a second layer of the printed wiring board;

wherein the second heating element is disposed on a third layer of the printed wiring board; and

wherein the second layer is disposed between the first layer and the third layer.

30. The power control system of claim 29 , wherein:

the fusible link circuit trace has two ends and a middle portion; and

the middle portion is narrower than the ends.

31. The power control system of claim 30 , wherein:

the printed wiring board includes a top layer, a middle layer, and a bottom layer;

the top layer and bottom layer have a thickness of no more than 3 mils; and

the bottom layer has a thickness of no less than 3 mils.

32. A printed circuit board, comprising:

a first trace; and

a second trace proximate the first trace;

wherein the first trace is configured to fuse when a current exceeding a first threshold flows through the first trace and the second trace;

wherein the second trace connects a first point to a second point;

wherein the length of the second trace is greater than the distance between the first and second points;

wherein the second trace is configured to generate heat;

wherein the first trace is configured to receive the generated heat; and

wherein the second trace is configured to concentrate the generated heat on the fusible link.

33. The printed circuit board of claim 32 , wherein the first trace is located on a first layer and the second trace is located on a second layer.

34. The printed circuit board of claim 33 , wherein the first trace and the second trace are located on adjacent layers of the printed wiring board.

35. The printed circuit board of claim 32 , further comprising:

a third trace proximate the first trace;

wherein, the third trace connects a first point to a second point; and

the length of the third trace is greater than the distance between the first and second points.

36. The printed circuit board of claim 32 , wherein the second trace includes a repeating pattern comprising a first section and a second section connected perpendicular to the first section.

37. The printed circuit board of claim 32 , wherein the first trace comprises:

at least a first section possessing a first width; and

at least a second section possessing a second width;

wherein the first width is greater than the second width.

38. A method of operating a power control system with a fusible link comprising:

measuring a current flow;

measuring a device state;

determining whether a fault has occurred using the measured current flow and determined device state; and

generating heat proximate the fusible link using a heating element;

wherein the fusible link comprises a circuit trace;

wherein the heating element comprises a circuit trace having a repeating pattern comprising a first section and a second section connected perpendicular to the first section; and

wherein the heating element is configured to concentrate the generated heat on the fusible link.