Flexible adhesive materials for micro-fluid ejection heads and methods relating thereto
View Patent ↗Micro-fluid ejection head structures, methods of making micro-fluid ejection head structures having improved operability, and methods for improving the durability of micro-fluid ejection head structures are provided. One such micro-fluid ejection head structure includes a micro-fluid ejection head having a substrate and nozzle plate assembly adhesively attached adjacent to a substrate support using a substrate adhesive. The nozzle plate is adhesively attached adjacent to the substrate with a nozzle plate adhesive. A thermally, UV or other cure mechanism encapsulant material is attached adjacent to the ejection head and substrate support. Each of the substrate adhesive, and the encapsulant material, after curing, have a Young's modulus of less than about 2000 MPa, a shear modulus at 25° C. of less than about 15 MPa, and a glass transition temperature of less than about 90° C.
1. A micro-fluid ejection head structure comprising:
a micro-fluid ejection head having a substrate and nozzle plate adhesively attached adjacent to a substrate support using a substrate adhesive, wherein the nozzle plate is adhesively attached adjacent to the substrate with a nozzle plate adhesive, and
an encapsulant material for the micro-fluid ejection head adjacent to the ejection head and substrate support,
wherein each of the substrate adhesive and the encapsulant material, after curing, have a Young's modulus of less than about 2000 MPa, a shear modulus at 25° C. of less than about 15 MPa, and a glass transition temperature of less than about 90° C.
2. The micro-fluid ejection head structure of claim 1 , wherein the nozzle plate adhesive has a Young's modulus of less than about 2000 MPa, a shear modulus at 25° C. of less than about 15 MPa, and a glass transition temperature of less than about 90° C.
3. The micro-fluid ejection head structure of claim 1 , wherein the substrate adhesive and at least a portion of the encapsulant material adjacent to electrical connections to the ejection head are substantially flexible after curing.
4. The micro-fluid ejection head structure of claim 3 , wherein the nozzle plate adhesive is substantially flexible after curing.
5. The micro-fluid ejection head structure of claim 1 , wherein any adhesive and encapsulant material in contact with the substrate support is substantially flexible after curing.
6. A method for reducing bowing or warping of a micro-fluid ejection head component, comprising:
adhesively bonding a nozzle plate to a substrate with a nozzle plate adhesive to provide a nozzle plate/substrate assembly;
adhesively bonding the nozzle plate/substrate assembly in a pocket of a substrate support using a substrate adhesive;
encapsulating electrical connections to the nozzle plate/substrate assembly with an encapsulant material adjacent to the nozzle plate/substrate assembly and substrate support; and
curing the nozzle plate adhesive, the substrate adhesive, and the encapsulant material,
wherein at least the substrate adhesive and the encapsulant material are substantially flexible after curing.
7. The method of claim 6 , wherein each of the substrate adhesive and the encapsulant material, after curing, have a Young's modulus of less than about 2000 MPa, a shear modulus at 25° C. of less than about 15 MPa, and a glass transition temperature of less than about 90° C.
8. The method of claim 6 , wherein the nozzle plate adhesive has a Young's modulus of less than about 2000 MPa, a shear modulus at 25° C. of less than about 15 MPa, and a glass transition temperature of less than about 90° C.
9. The method of claim 6 , wherein the encapsulant material comprises first side and second side encapsulant materials adjacent to the electrical connections, further comprising, at least partially co-curing the first side and second side encapsulating materials.
10. The method of claim 6 , wherein each of the substrate adhesive, the nozzle plate adhesive, and the encapsulant material, after curing, have a Young's modulus of no more than about 1500 MPa, a shear modulus at 25° C. of no more than about 10 MPa, and a glass transition temperature of no higher than about 60° C.
11. The method of claim 6 , wherein the substrate adhesive, the nozzle plate adhesive, and the encapsulant material respectively comprise a thermally curable substrate adhesive, a thermally curable nozzle plate adhesive, and at least one of a thermally curable encapsulant material and an ultraviolet (UV) curable encapsulant material.
12. A method for improving micro-fluid ejection head durability, comprising:
adhesively bonding a nozzle plate adjacent to a substrate with a nozzle plate adhesive to provide a nozzle plate/substrate assembly;
adhesively bonding the nozzle plate/substrate assembly in a pocket of a substrate support using a substrate adhesive;
encapsulating electrical connections to the nozzle plate/substrate assembly with an encapsulant material adjacent to the nozzle plate/substrate assembly and substrate support structure; and
curing the nozzle plate adhesive, the substrate adhesive, and the encapsulant material,
wherein the nozzle plate adhesive, the substrate adhesive, and the encapsulant material are substantially flexible after curing, and the micro-fluid ejection head has a greater drop height than an ejection head made in the absence of substantially flexible encapsulant material and substantially flexible adhesives.
13. The method of claim 12 , wherein each of the substrate adhesives the nozzle plate adhesive, and the encapsulant material, after curing, have a Young's modulus of less than about 2000 MPa, a shear modulus at 25° C. of less than about 15 MPa, and a glass transition temperature of less than about 90° C.
14. The method of claim 12 , wherein the encapsulant material comprises first side and second side encapsulant materials adjacent to the electrical connections, further comprising, at least partially co-curing the first side and second side encapsulating materials.
15. The method of claim 12 , wherein each of the substrate adhesive, the nozzle plate adhesive, and the encapsulant material, after curing, have a Young's modulus of no more than about 1500 MPa, a shear modulus at 25° C. of no more than about 10 MPa, and a glass transition temperature of no higher than about 60° C.
16. The method of claim 12 , wherein the substrate adhesive, the nozzle plate adhesive, and the encapsulant material are each at least one of thermally curable adhesive and ultraviolet (UV) curable adhesive.
17. A micro-fluid ejection device comprising a micro-fluid ejection head made by the method of claim 12 .