SPUTTERING SYSTEM USING SILVER-BASED ALLOY
An alloy based on silver is provided, which can be used for reflective layers with a reflection factor of >90% in the visible spectral range of daylight and which exhibits a high resistance to corrosion in sulfur-containing atmospheres. The alloy contains about 0.01 to 5 wt % indium and/or tin and/or antimony and/or bismuth and the remainder silver.
1 . In a sputtering system having a cathode sputtering target, the improvement comprising utilizing as a sputtering material for a sputtering target an alloy based on silver, wherein the alloy comprises about 0.01 to 5 wt % of at least one metal selected from the group consisting of indium, tin, antimony, and bismuth, and a remainder of the alloy comprises silver.
2 . The sputtering system according to claim 1 , wherein the alloy comprises about 0.5 to 3 wt % of at least one metal selected from the group consisting of indium, tin, antimony, and bismuth, and the remainder of the alloy comprises silver.
3 . The sputtering system according to claim 2 , wherein the alloy comprises about 0.5 to 1 wt % of at least one metal selected from the group consisting of indium, tin, antimony, and bismuth, and the remainder of the alloy comprises silver.
4 . The sputtering system according to claim 3 , wherein the alloy comprises about 0.5 wt % tin and the remainder of the alloy comprises silver.
5 . The sputtering system according to claim 3 , wherein the alloy comprises about 1 wt % tin and the remainder of the alloy comprises silver.
6 . The sputtering system according to claim 3 , wherein the alloy comprises about 0.5 wt % indium and the remainder of the alloy comprises silver.
7 . The sputtering system according to claim 3 , wherein the alloy comprises about 1 wt % indium and the remainder of the alloy comprises silver.
8 . The sputtering system according to claim 3 , wherein the alloy comprises about 0.5 wt % tin, 0.5 wt % indium, and the remainder of the alloy comprises silver.