IP Library Granted Patent US 7,579,925
Granted Patent B2
US 7,579,925 · App. 11/557,985 · Granted Aug 25, 2009

Adjusting a characteristic of a conductive via stub in a circuit board

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Quick Facts
Patent No.
US 7,579,925
App. No.
11/557,985
Granted
Aug 25, 2009
Kind
B2
Abstract

A circuit board construction which reduces unwanted electrical effects and lower signal quality resulting from the use of vias in relatively thick circuit boards or in circuit boards carrying signals of relatively high frequency. The circuit board includes a through-hole in the circuit board substrate for carrying a conductive via stub, the stub having an inherent stub characteristic; and a compensation element, such as a surface mount capacitor, positioned on the substrate such that when the stub is carried by the through-hole the inherent stub characteristic is adjusted to define a compensated stub characteristic.

Claims (14)

1. A circuit board including:

a substrate;

a through-hole in the substrate for carrying a conductive via stub, the stub having an inherent stub characteristic, said inherent stub characteristic being an inherent resonant frequency; and

a compensation element positioned on the substrate such that when the stub is carried by the through-hole the inherent stub characteristic is adjusted to define a compensated stub characteristic, said compensated stub characteristic being a compensated resonant frequency;

wherein the stub includes a primary portion defined on a signal path for transmitting a signal having a predetermined signal frequency range and the compensated resonant frequency is outside of the predetermined signal frequency range.

2. A circuit board according to claim 1 wherein the inherent stub characteristic is adjusted to increase the suitability of the circuit board for a predetermined application.

3. A circuit board according to claim 1 wherein the compensation element includes a capacitive element for loading the carried stub.

4. A method for adjusting an inherent resonant frequency of a via stub when that stub is carried by a substrate, said stub including a primary portion defined on a signal path for transmitting a signal having a predetermined signal frequency range, the method including the steps of:

providing a through-hole in the substrate for carrying the via stub; and

positioning in the circuit board a compensation element for adjusting the inherent resonant frequency outside of said predetermined signal frequency range.

5. A circuit board for carrying a signal having a predefined bandwidth, the circuit board including:

a plated through hole via having an inherent resonant frequency; and

a compensation element for influencing the via such that the inherent resonant frequency is shifted outside of the predetermined bandwidth.

6. A circuit board according to claim 5 wherein the compensation element is a capacitive element.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 18, 2008
From: NCR CORPORATION
To: TERADATA US, INC.
Reel/Frame 020666/0438 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 9, 2006
From: FAN, JUN; ALEXANDER, ARTHUR RAY; KNIGHTEN, JAMES; SMITH, NORMAN
To: NCR CORPORATION
Reel/Frame 018499/0496 →