Superhard cutters and associated methods

1. A cutting device, comprising:

a base having a solidified organic material layer disposed thereon; and

a plurality of individual polycrystalline cutting elements, formed from a different material than the solidified organic material layer and being secured in the solidified organic material layer, each of the plurality of individual polycrystalline cutting elements having a substantially matching geometric configuration, each of the individual polycrystalline cutting elements being an equal, divided, wedge-shaped sector of a polycrystalline blank of material shaped as a disk.

2. The cutting device of claim 1 , wherein each of the plurality of individual polycrystalline cutting elements includes at least one cutting tip, the tips of the cutting elements being aligned in a common plane.

3. The cutting device of claim 1 , wherein the individual polycrystalline cutting elements are radially distributed about the face of the cutting device.

4. The cutting device of claim 1 , wherein the individual polycrystalline cutting elements are distributed on the cutting device in alternating orientations.

5. The cutting device of claim 1 , further comprising a series of secondary cutting elements formed on a face of each of the individual polycrystalline cutting elements, the secondary cutting elements being configured to maintain a sharpness of each of the cutting elements during use of the cutting device.

6. A cutting device, comprising:

a base having a solidified organic material layer attached thereto;

a plurality of individual polycrystalline cutting elements, formed from a different material than the solidified organic material layer and being secured in the solidified organic material layer, each of the plurality of individual polycrystalline cutting elements including at least one cutting tip, the tips of the cutting elements being aligned in a common plane, each of the individual polycrystalline cutting elements being an equal, divided, wedge-shaped sector of a polycrystalline blank of material shaped as a disk.

7. The cutting device of claim 6 , wherein arrangement of the individual polycrystalline cutting elements uniformly distributes drag forces across substantially each individual polycrystalline cutting element.

8. The cutting device of claim 6 , wherein a majority of each of the individual polycrystalline cutting elements protrudes to a predetermined height above the solidified organic material layer.

9. The cutting device of claim 8 , wherein the predetermined height produces a cutting depth of less than about 20 microns when used to abrade a workpiece.

10. The cutting device of claim 6 , wherein each of the plurality of individual polycrystalline cutting elements has a substantially matching geometric configuration.

11. The cutting device of claim 6 , wherein the individual polycrystalline cutting elements are radially distributed about the organic material layer.

12. The cutting device of claim 6 , wherein the individual polycrystalline cutting elements are of substantially the same size and substantially the same shape.

13. The cutting device of claim 6 , wherein the individual polycrystalline cutting elements are arranged as a grid.

14. The cutting device of claim 13 , wherein the individual polycrystalline cutting elements are evenly spaced from one another at a distance of from about 100 microns to about 800 microns.

15. The cutting device of claim 14 , wherein the individual polycrystalline cutting elements are evenly spaced from one another at a distance of about 500 microns.

16. The cutting device of either of claim 1 or claim 6 , wherein the solidified organic material layer comprises a member selected from the group consisting of amino resins, acrylate resins, alkyd resins, polyester resins, polyamide resins, polyimide resins, polyurethane resins, phenolic resins, phenolic/latex resins, epoxy resins, isocyanate epoxy resins, isocyanate resins, isocyanurate resins, polysiloxane resins, reactive vinyl resins, polyethylene resins, polypropylene resins, polystyrene resins, phenoxy resins, perylene resins, polysulfone resins, acrylonitrile-butadiene-styrene resins, acrylic resins, polycarbonate resins, polyimide resins, and mixtures thereof.

17. The cutting device of claim 16 , wherein the solidified organic material layer is an epoxy resin.

18. The cutting device of claim 16 , wherein the solidified organic material layer is a polyurethane resin.

19. The cutting device of claim 16 , wherein the solidified organic material layer is a polyimide resin.

20. The cutting device of claim 16 , further comprising a reinforcing material disposed within at least a portion of the solidified organic material layer.

21. The cutting device of claim 20 , wherein the reinforcing material is a material selected from the group consisting of ceramics, metals, or combinations thereof.

22. A method of forming a cutting device, comprising:

obtaining a substrate;

dividing a polycrystalline disk blank into a plurality of individual polycrystalline cutting elements, each of the cutting elements having a substantially matching geometric configuration and being a substantially equal, divided, wedge-shaped sector of the disk blank;

arranging on the substrate the plurality of individual polycrystalline cutting elements; and

securing each of the plurality of individual polycrystalline cutting elements to the substrate with a solidified organic material layer, wherein

the solidified organic material layer and the polycrystalline cutting elements are formed from different materials.

23. The method of claim 22 , further comprising aligning at least one cutting tip of each of the plurality of individual polycrystalline cutting elements in a common plane.

24. The method of claim 22 , wherein the individual polycrystalline cutting elements are radially distributed about the substrate.

25. The method of claim 22 , wherein the individual polycrystalline cutting elements are evenly spaced from one another at a distance of from about 100 microns to about 800 microns.

26. The cutting device of either of claim 1 or claim 6 , wherein the polycrystalline cutting elements comprise superhard polycrystalline cutting elements.

27. The cutting device of claim 26 , wherein the superhard polycrystalline cutting elements comprise superhard polycrystalline particles.

28. The method of claim 22 , where the polycrystalline cutting elements comprise superhard polycrystalline cutting elements.

29. The method of claim 28 , wherein the superhard polycrystalline cutting elements comprise superhard polycrystalline particles.

30. The method of claim 28 , wherein the superhard polycrystalline cutting elements are selected from the group consisting of: polycrystalline diamond and polycrystalline cubic boron nitride.