IP Library Granted Patent US 8,035,230
Granted Patent B2
US 8,035,230 · App. 11/561,590 · Granted Oct 11, 2011

Semiconductor device and method for manufacturing same

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Quick Facts
Patent No.
US 8,035,230
App. No.
11/561,590
Granted
Oct 11, 2011
Kind
B2
Abstract

This invention discloses a semiconductor device including an insulating film having a recess therein; an electric conductor formed inside the recess; a manganese silicate film formed on an upper surface of the conductor, the manganese silicate film being formed of a reaction product of a manganese with a silicon oxide insulating film. A method for manufacturing such a semiconductor device is also described.

Claims (10)

1. A semiconductor device comprising:

an insulating film having a recess therein;

an electric conductor formed inside the recess;

a silicon oxide insulating film on the insulating film and the electric conductor;

a barrier film composed of manganese silicate provided at an interface between an inner surface of said recess and said conductor; and

a manganese silicate film formed directly on top of an upper surface of said electric conductor between said electric conductor and said silicon oxide insulating film,

wherein,

said electric conductor includes manganese,

said barrier film provided at an interface between the inner surface of said recess and said conductor is contiguous to said manganese silicate film formed on the upper surface of said conductor, and

said manganese silicate film is a product of a reaction between the manganese in said electric conductor and said silicon oxide insulating film.

Assignments (6)
CHANGE OF NAME Recorded Nov 19, 2025
From: TESSERA ADVANCED TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR ADVANCED TECHNOLOGIES INC.
Reel/Frame 073635/0304 →
RELEASE OF SECURITY INTEREST Recorded Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION; TESSERA ADVANCED TECHNOLOGIES, INC; DTS, INC.; DTS LLC; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
Reel/Frame 052920/0001 →
SECURITY INTEREST Recorded Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.; VEVEO, INC.; INVENSAS CORPORATION; INVENSAS BONDING TECHNOLOGIES, INC.; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; DTS, INC.; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
SECURITY INTEREST Recorded Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.; DIGITALOPTICS CORPORATION; DIGITALOPTICS CORPORATION MEMS; DTS, LLC; DTS, INC.; PHORUS, INC.; IBIQUITY DIGITAL CORPORATION
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 16, 2015
From: SONY CORPORATION
To: TESSERA ADVANCED TECHNOLOGIES, INC.
Reel/Frame 035430/0231 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 3, 2008
From: ARAKAWA, SHINICHI
To: SONY CORPORATION
Reel/Frame 020588/0458 →