Laminated structure method
View Patent ↗A laminated structure having an electrode hard to peel off and a method of manufacturing the laminated structure. The laminated structure has: a backing substrate; a lower electrode including an adhesive layer containing a metal oxide and a conductive layer formed on the backing substrate with the adhesive layer therebetween; a dielectric layer disposed on the lower electrode; and an upper electrode disposed on the dielectric layer. Further, the method includes the steps of: (a) disposing a lower electrode by forming a conductive layer on a backing substrate with an adhesive layer containing a metal oxide therebetween; (b) disposing a dielectric layer by spraying powder of a dielectric material to the lower electrode for deposition; (c) heat-treating the dielectric layer; and (d) forming an upper electrode on the dielectric layer before or after step (c).
1. A method of manufacturing a laminated structure, said method comprising the steps of:
(a) disposing a first electrode by forming a conductive layer on a backing substrate with an adhesive layer containing a metal oxide therebetween;
(b) disposing a dielectric layer on said first electrode by spraying powder of a dielectric material to said first electrode for deposition;
(c) heat-treating said dielectric layer; and
(d) forming a second electrode on said dielectric layer.
2. A method of manufacturing a laminated structure, said method comprising the steps of:
(a) disposing a first electrode by forming a conductive layer on a backing substrate with an adhesive layer containing a metal oxide therebetween;
(b) disposing a dielectric layer on said first electrode by spraying powder of a dielectric material to said first electrode for deposition;
(c) disposing a second electrode by forming a conductive layer on said dielectric layer with an adhesive layer containing a metal oxide therebetween;
(d) disposing a dielectric layer on said second electrode by spraying powder of a dielectric material to said second electrode for deposition;
(e) heat-treating said dielectric layers; and
(f) forming a third electrode on said dielectric layer disposed at step (d).
3. The method according to claim 2 , further comprising the step of:
repeating steps (c) to (d) for a predetermined number of times.
4. A method of manufacturing a laminated structure, said method comprising the steps of:
(a) disposing a dielectric layer by spraying powder of a dielectric material to a backing substrate for deposition;
(b) disposing a first electrode by forming a conductive layer on said dielectric layer with an adhesive layer containing a metal oxide therebetween;
(c) disposing a dielectric layer on said first electrode by spraying powder of a dielectric material to said first electrode for deposition;
(d) heat-treating said dielectric layers;
(e) forming a second electrode on said second dielectric layer disposed at step (c); and
(f) removing said backing substrate from said dielectric layer.
5. The method according to claim 4 , further comprising the step of:
repeating steps (b) to (c) for a predetermined number of times.