Method for one-to-one polishing of silicon nitride and silicon oxide
View Patent ↗The present invention provides a method of removing silicon nitride at about the same removal rate as silicon dioxide by CMP. The method utilizes a polishing slurry that includes colloidal silica abrasive particles dispersed in water and additives that modulate the silicon dioxide and silicon nitride removal rates such that they are about the same. In one embodiment of the invention, the additive is lysine or lysine mono hydrochloride in combination with picolinic acid, which is effective at a pH of about 8. In another embodiment of the invention, the additive is arginine in combination with picolinic acid, which is effective at a pH of about 10.
1. A method for removing silicon nitride and silicon dioxide from a surface, the method comprising:
a) providing a polishing slurry having a pH of about 8±0.5 that comprises colloidal silica abrasive particles dispersed in water and an additive comprising:
i) about 1.0% to about 4.0% by weight of lysine mono hydrochloride; and
ii) picolinic acid or a derivative thereof;
b) disposing the polishing slurry between a polishing pad and the surface; and
c) pressing the polishing pad against the surface while the polishing pad and surface are moving relative to each other with the polishing slurry disposed therebetween to remove silicon nitride from the surface at about the same rate as silicon dioxide is removed from the surface.
2. The method according to claim 1 wherein the polishing slurry comprises from about 5% to about 15% by weight of silica particles having a mean average diameter of from about 25 nm to about 75 nm.
3. The method according to claim 1 wherein the polishing slurry comprises from about 1.0% to about 3.0% by weight of picolinic acid.
4. The method according to claim 1 wherein the polishing slurry comprises about 10% by weight of silica particles having a mean average diameter of about 50 nm and from about 1% to about 3% by weight of lysine mono hydrochloride.
5. The method according to claim 4 wherein the polishing slurry comprises from about 1.0% to about 3.0% by weight of picolinic acid.