Heat sink and method for its production
View Patent ↗A method for producing a heat sink for cooling a semiconductor device including forming plural base members, the base member being each in plate or block-shape, the base member each having paths shaped on one or both sides of surfaces thereof, and the base member each having connecting regions on one or both sides of surfaces thereof, coating a coating layer of Au onto the base members, putting a solder of Sn or Au—Sn alloy onto connecting regions, the connecting region being coated with the coating layer of Au, assembling the base members together such that the base members are bonding to each other at the connecting region and the paths shaped on each of the surfaces of the base members form a communicating flow path for a cooling medium inside the bonded base members, and heating to diffuse Sn from the solder of Sn or Au—Sn alloy into the coating layer of Au, and to make a bond layer of alloy containing at least 91 wt % of Au and at most 9 wt % of Sn, the bond layer being interposed between connecting regions to which the base member each connects.
1. A method for producing a heat sink for cooling a semiconductor device, comprising the steps of:
forming plural base members, the base member being each in plate or block-shape, the base member each having paths shaped on one or both sides of surfaces thereof, and the base member each having connecting regions on one or both sides of surfaces thereof;
coating a coating layer of Au onto the base members;
putting a solder of Sn or Au—Sn alloy onto connecting regions, the connecting region being coated with the coating layer of Au;
assembling the base members together such that the base members are bonding to each other at the connecting region and the paths shaped on each of the surfaces of the base members form a communicating flow path for a cooling medium inside the bonded base members; and
heating to diffuse Sn from the solder of Sn or Au—Sn alloy into the coating layer of Au, and to make a bond layer of alloy containing at least 91 wt % of Au and at most 9 wt % of Sn, the bond layer being interposed between connecting regions to which the base member each connects.
2. The method according to claim 1 , further comprising a step of:
coating a coating layer of Ni onto the base members, wherein the coating layer of Ni is overlaid with the coating layer of Au.
3. The method according to claim 1 , wherein a solder of Sn or Au—Sn alloy is in a form of sheet or in vapor phase, and the heating is performed at a temperature not lower than a liquidus line of the solder.
4. The method according to claim 1 , further comprising the steps of:
making a coating layer of the solder of Sn or Au—Sn alloy, when the solder of Sn or Au—Sn alloy being put onto connecting regions, such that the coating layer of the solder of Sn or Au—Sn alloy overlays the coating layer of Au; and
pressing a pair of the base members toward each other, when heating,
wherein the heating is performed at a temperature not lower than a liquidus line of the solder.
5. The method according to claim 1 , further comprising the steps of:
pressing a pair of the base members toward each other, when heating,
wherein the heating is performed at a temperature of 280 to 600° C. for 1 to 120 minutes, and the pressing is performed at a pressure of 0.1-10 Mpa.