IP Library Granted Patent US 7,456,364
Granted Patent B2
US 7,456,364 · App. 11/563,729 · Granted Nov 25, 2008

Using a thru-hole via to improve circuit density in a PCB

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Quick Facts
Patent No.
US 7,456,364
App. No.
11/563,729
Granted
Nov 25, 2008
Kind
B2
Abstract

A printed circuit board includes multiple layers on which electrically conductive traces reside, where at least two of the electrically conductive traces each has a first portion formed on one layer of the printed circuit board and a second portion formed on another layer of the printed circuit board. The printed circuit board also includes a thru-hole via that includes at least two electrically conductive portions electrically isolated from each other, such that each of the electrically conductive portions connects electrically to both the first and second portions of a corresponding one of the electrically conductive traces.

Claims (8)

1. A printed circuit board comprising:

multiple layers on which electrically conductive traces reside, where at least two of the electrically conductive traces each has a first portion formed on one layer of the printed circuit board and a second portion formed on another layer of the printed circuit board; and

a thru-hole via that includes at least two electrically conductive portions electrically isolated from each other, such that each of the electrically conductive portions connects electrically to both the first and second portions of a corresponding one of the electrically conductive traces;

where at least one of the layers of the circuit board contacts at least two of the electrically conductive portions of the thru-hole via.

2. The printed circuit board of claim 1 , where the electrically conductive traces run in directions that are parallel to each other.

3. The printed circuit board of claim 1 , where the electrically conductive traces run in directions that are perpendicular to each other, and where the first and second portions of at least one of the electrically conductive traces are co-linear with each other.

4. The printed circuit board of claim 1 , where the electrically conductive traces run in directions that are perpendicular to each other, and where the first and second portions of at least one of the electrically conductive traces are not co-linear with each other.

5. The printed circuit board of claim 1 , where the electrically conductive traces are positioned to reside in separate circuits in the printed circuit board.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 18, 2008
From: NCR CORPORATION
To: TERADATA US, INC.
Reel/Frame 020666/0438 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 28, 2006
From: KNIGHTEN, JAMES L.; FAN, JUN; SMITH, NORMAN
To: NCR CORPORATION
Reel/Frame 018555/0520 →