IP Library Granted Patent US 8,562,871
Granted Patent B2
US 8,562,871 · App. 11/563,736 · Granted Oct 22, 2013

Composition and associated method

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Quick Facts
Patent No.
US 8,562,871
App. No.
11/563,736
Granted
Oct 22, 2013
Kind
B2
Abstract

A composition includes a filler dispersed in a polymeric matrix. The filler may be electrically conducting in a temperature range and may have a Curie temperature. The composition may have a trip temperature at which electrical resistance of the composition increases with increase in temperature, and the trip temperature of the composition may be determined by the Curie temperature of the filler. The filler may be present in the polymeric matrix in an amount determined by a property of one or both of the polymeric matrix or the filler. An associated method is provided.

Claims (40)

1. A composition comprising:

a polymeric matrix; and

a filler dispersed in the polymeric matrix, and the filler is electrically conducting in a temperature range and the filler has a Curie temperature,

a second electrically conducting filler comprising one or more of carbon black, carbon nanotubes, graphite, a metal a metal-coated filler, or combinations of two or more thereof; the second filler being present in an amount that is less than a percolation limit; where the second electrically conducting filler is present in an amount of about 1 to 3 wt %; based on the total weight of the composition; and

the composition has a trip temperature at which electrical resistance of the composition increases with increase in temperature, and the trip temperature of the composition is determined by the Curie temperature of the filler.

2. The composition as defined in claim 1 , wherein the filler comprises a ceramic material comprising a metal oxide, a mixed metal oxide, or both a metal oxide and a mixed metal oxide.

3. The composition as defined in claim 1 , wherein the filler comprises one or more of alkali earth metals, transition metals, or post transition metals.

4. The composition as defined in claim 3 , wherein the filler comprises one or more of barium, calcium, magnesium, lead, strontium, titanium, tin, zirconium, or hafnium.

5. The composition as defined in claim 4 , wherein the filler comprises one or more of barium titanate, lead titanate, strontium titanate, barium strontium titanate, barium lead titanate, barium tin titanate, strontium lead titanate, strontium tin titanate, or lead tin titanate.

6. The composition as defined in claim 1 , wherein the filler comprises a dopant comprising cations of one or more of rare earth metals, alkaline earth metals, transition metals, or post-transition metals.

7. The composition as defined in claim 6 , wherein the dopant comprises cations of one or more of lanthanum, niobium, antimony, scandium, yttrium, neodynium, or samarium.

8. The composition as defined in claim 1 , wherein the filler has a Curie temperature in a range from about 20 degrees Celsius to about 120 degrees Celsius.

9. The composition as defined in claim 1 , wherein the filler has a Curie temperature in a range from about 120 degrees Celsius to about 400 degrees Celsius.

10. The composition as defined in claim 1 , wherein the filler comprises a plurality of particles having an average particle size in a range from about 1 nanometer to about 100 nanometers.

11. The composition as defined in claim 1 , wherein the filler has a plurality of particles having an average particle size in a range from about 0.1micrometers to about 50 micrometers.

12. The composition as defined in claim 1 , wherein the filler comprises a plurality of particles having a shape of a sphere, a rods, a tube, a flake, a fiber, a plates, or a whisker, or the plurality includes a combination of two or more of the foregoing shapes.

13. The composition as defined in claim 12 , wherein a cross-sectional geometry of the particle is circular, ellipsoidal, triangular, rectangular, or polygonal.

14. The composition as defined in claim 1 , wherein the filler is present in an amount in a range of from about 50 weight percent to about 99 weight percent of the composition.

15. The composition as defined in claim 1 , wherein the filler is present in an amount in a range of from about 10 weight percent to about 50 weight percent of the composition.

16. The composition as defined in claim 6 , wherein the dopant is present in an amount in a range of less than about 5 atomic percent of the filler.

17. The composition as defined in claim 16 , wherein the dopant is present in an amount in a range of from about 0.1 atomic percent to about 1 atomic percent of the filler.

18. The composition as defined in claim 1 , wherein the polymeric matrix comprises one or more of a crystalline polymer, a thermoplastic polymer, or an organic polymer.

19. The composition as defined in claim 1 , wherein the polymeric matrix comprises one or more of an amorphous polymer, a thermoset polymer, or an inorganic polymer.

20. The composition as defined in claim 1 , wherein the trip temperature of the composition is in a range from about 20 degrees Celsius to about 120 degrees Celsius.

21. The composition as defined in claim 1 , wherein the trip temperature of the composition is in a range from about 120 degrees Celsius to about 400 degrees Celsius.

22. The composition as defined in claim 1 , wherein the composition has a room temperature electrical resistance in a range of less than about 200 Mega ohm-centimeter.

23. The composition as defined in claim 1 , wherein the composition has a room temperature electrical resistance in a range of from about 1 MegaOhm to about 100 MegaOhms.

24. The composition as defined in claim 1 , wherein an electrical resistance of the composition at the trip temperature is greater than an electrical resistance of the composition at the room temperature by a factor of at least about 1.5.

25. The composition as defined in claim 1 , wherein the composition has a melt viscosity in a range of from about 10 Pascal.seconds to about 1000Pascal. seconds at about 1500 seconds −1 shear rate.

26. The composition as defined in claim 1 , wherein the composition has a viscosity or a melt profile so as to be processable by one or more of injection molding, blow molding, or extrusion.

27. A method, comprising:

dispersing an electrically conducting filler having a Curie temperature in a polymeric matrix to form a composition having a trip temperature, and an electrical resistance of the composition increases with an increase in temperature; and

selecting the filler to be of a type based on the filler Curie temperature, or the amount of the filler, or both the amount and the type of the filler so as to tune the trip temperature of the composition; and

further containing a second electrically conducting filler comprising one or more of carbon black, carbon nantubes, graphite, a meteal, a metal-coated filler, or combinations of two or more thereof; the second filler being present in an amount that is less than a percolation limit; where the second electrically conducting filler is present in an amount of about 1 to about 3 wt % based on the total weight of the composition; and

the composition has a trip temperature at which electrical resistance of the composition increases with increase in temperature, and the trip temperature of the composition is determined by the Curie temperature of the filler.

28. The method as defined in claim 27 , wherein the composition is flowable under process conditions, and further comprising extruding or injection molding the composition to form an article.

29. A composition comprising:

a polymeric matrix;

a filler comprising one or more of, lead titanate, barium strontium titanate, barium lead titanate, barium tin titanate, strontium lead titanate, strontium tin titanate, or lead tin titanate;

a second filler comprising carbon black, graphite, carbon nanotubes or combinations thereof; the second filler being present in an amount that is less than a percolation threshold; where the second filler is present in amounts of about 1 to about 3 wt %, based on the total weight of the composition.

Assignments (7)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE THE APPLICATION NUMBER 15039474 PREVIOUSLY RECORDED AT REEL: 054528 FRAME: 0467. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Mar 23, 2021
From: SABIC GLOBAL TECHNOLOGIES B.V.
To: SHPP GLOBAL TECHNOLOGIES B.V.
Reel/Frame 057453/0680 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 26, 2020
From: SABIC GLOBAL TECHNOLOGIES B.V.
To: SHPP GLOBAL TECHNOLOGIES B.V.
Reel/Frame 054528/0467 →
CHANGE OF NAME Recorded Jun 6, 2016
From: SABIC INNOVATIVE PLASTICS IP B.V.
To: SABIC GLOBAL TECHNOLOGIES B.V.
Reel/Frame 038883/0816 →
RELEASE OF SECURITY INTEREST Recorded Mar 17, 2014
From: CITIBANK, N.A.
To: SABIC INNOVATIVE PLASTICS IP B.V.
Reel/Frame 032459/0798 →
SECURITY AGREEMENT Recorded Aug 18, 2008
From: SABIC INNOVATIVE PLASTICS IP B.V.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 021423/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 1, 2008
From: GENERAL ELECTRIC COMPANY
To: SABIC INNOVATIVE PLASTICS IP B.V.
Reel/Frame 020985/0551 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 28, 2006
From: KHATUA, BHANU BHUSAN; BANDYOPADHYAY, SUMANDA; GHOSH, SOUMYADEB; SESHADRI, HARI NADATHUR; MERCX, FRANCISCUS PETRUS MARIA
To: GENERAL ELECTRIC COMPANY
Reel/Frame 018555/0781 →