PASSING MULTIPLE CONDUCTIVE TRACES THROUGH A THRU-HOLE VIA IN A PCB
A printed circuit board has one or more layers on which electrically conductive traces reside. The printed circuit board also includes a thru-hole via formed in one or more of the layers. The thru-hole via includes at least two electrically conductive portions that are electrically isolated from each other, where the electrically conductive portions connect electrically to separate conductive traces.
1 . A printed circuit board comprising:
one or more layers on which electrically conductive traces reside; and
a thru-hole via formed in one or more of the layers;
where the thru-hole via includes at least two electrically conductive portions that are electrically isolated from each other; and
where the electrically conductive portions of the thru-hole via connect electrically to separate conductive traces.
2 . The printed circuit board of claim 1 , further comprising two or more mounting pads positioned for mounting a single circuit component, where one of the mounting pads connects electrically to one of the electrically conductive portions of the thru-hole via, and where another of the mounting pads connects electrically to another of the electrically conductive portions of the thru-hole via.
3 . The printed circuit board of claim 2 , where two of the mounting pads are positioned on opposite sides of the thru-hole via.
4 . The printed circuit board of claim 2 , where the mounting pads are positioned on one surface of the printed circuit board, and where the electrically conductive traces to which the electrically conductive portions of the thru-hole via connect the mounting pads reside on another surface of the board.
5 . The printed circuit board of claim 1 , where the printed circuit board includes multiple layers.
6 . The printed circuit board of claim 5 , where the thru-hole via penetrates all of the layers.
7 . A printed circuit board comprising:
multiple layers, including one or more reference-voltage layers and one or more layers on which electrically conductive traces reside; and
a thru-hole via having at least two electrically conductive portions that are electrically isolated from each other,
where one of the electrically conductive portions connects electrically to one of the reference-voltage layers; and
where the another of the electrically conductive portions connects electrically to one of the electrically conductive traces.
8 . The printed circuit board of claim 7 , further comprising at least two mounting pads positioned for mounting a single circuit component, where one of the mounting pads connects electrically to one of the electrically conductive portions of the thru-hole via, and where another of the mounting pads connects electrically to another of the electrically conductive portions of the thru-hole via.
9 . The printed circuit board of claim 8 , where two of the mounting pads are positioned on opposite sides of the thru-hole via.
10 . The printed circuit board of claim 8 , where the mounting pads are positioned on one surface of the printed circuit board, and where the electrically conductive trace to which the one mounting pad is connected electrically resides on another surface of the board.
11 . The printed circuit board of claim 7 , where the thru-hole via penetrates all layers of the printed circuit board.
12 . A method for use in manufacturing a printed circuit board, the method comprising:
drilling a first hole in the printed circuit board;
drilling a second hole in the printed circuit board in a position that intersects the first hole;
applying an electrically conductive material inside the first and second holes; and then
drilling a third hole in the printed circuit board in a position that intersects both the first and second holes to form a thru-hole via with two electrically conductive portions that are electrically isolated from each other.
13 . The method of claim 12 , where the printed circuit board includes multiple layers, and where drilling the first, second and third holes includes drilling the holes to penetrate all layers of the printed circuit board.
14 . The method of claim 12 , further comprising forming on the circuit board at least two mounting pads positioned for mounting a single electronic component, such that one of the mounting pads connects electrically to one of the electrically conductive portions of the thru-hole via and another of the mounting pads connects electrically to the other electrically conductive portion of the thru-hole via.
15 . The method of claim 12 , further comprising forming electrically conductive traces on the printed circuit board, such that each of the electrically conductive portions of the thru-hole via connects to at least one of the electrically conductive traces.