Solder-bearing wafer for use in soldering operations

1. An electrical connector for electrical connection to a second electronic device having at least one second contact comprising:

a substrate having a first surface and an opposing second surface, with a recess being formed in the first surface;

a first contact securely coupled to the substrate and having a first portion extending at least partially into the recess; and

a mass of solder material disposed in the recess and retainingly held by the recess such that the first portion of the first contact is in contact with the solder material, the first surface being for placement against the second electronic device such that the first and second contacts are aligned and whereupon heating of the mass of solder material, the first and second contacts are securely attached to one another and form an electrical pathway therebetween,

wherein an opening to the recess is defined along the first surface, the opening having a width less than a maximum width of the mass of solder material disposed within the recess such that the mass of solder material is captured within the recess.

2. The electrical connector of claim 1 , wherein the substrate comprises a block with first surface being a bottom surface thereof and the second surfacing being the top surface thereof.

3. The electrical connector of claim 1 , wherein the first contact comprises a conductive pin and the first portion comprises a first end of the pin, the pin extending through the substrate to the second surface where a length of the pin extends beyond the second surface.

4. The electrical connector of claim 3 , where the first end of the pin extends beyond a floor of the recess and is at least partially embedded into the mass of solder material.

5. The electrical connector of claim 4 , wherein the first end of the pin terminates prior to the opening of the recess along the first surface.

6. The electrical connector of claim 1 , wherein the mass of solder material is selected from the group consisting of a solder ball, a segment of solder wire, a solder slug, and a solder block.

7. The electrical connector of claim 1 , wherein the recess includes a floor through which the first contact extends.

8. The electrical connector of claim 1 , wherein there is a plurality of first contacts and a plurality of recesses, both of which are arranged according to a predetermined pattern.

9. The electrical connector of claim 8 , wherein there is a space formed between each recess along the first surface so that each recess is separate from the others.

10. An electrical connector for electrical connection to a second electronic device having at least one second contact comprising:

a substrate having a first surface and an opposing second surface, with a recess being formed in the first surface;

a first contact securely coupled to the substrate and having a first portion extending at least partially into the recess; and

a mass of solder material retainingly held in the recess such that the first portion of the first contact is in contact with the solder material, the first surface being for placement against the second electronic device such that the first and second contacts are aligned and whereupon heating of the mass of solder material, the first and second contacts are securely attached to one another and form an electrical pathway therebetween,

wherein the recess includes a floor through which the first contact extends, and

wherein an opening to the recess is defined along the first surface, with a width of the opening being less than a width of the floor resulting in the mass of solder material being captured within the recess.

11. A combination of electrical components comprising:

an electrical connector comprising:

a substrate having a first surface and an opposing second surface, with a recess being formed in the first surface;

a first contact securely coupled to the substrate and having a first portion extending at least partially into the recess; and

a mass of solder material disposed in the recess and retainingly held by the recess such that the first portion of the first contact is in contact with the solder material; and

an electronic device having a second contact and a surface that faces the first surface of the substrate, the first and second contacts being aligned with one another and whereupon heating of the mass of solder material, the first and second contacts are securely attached to one another and form an electrical pathway therebetween,

wherein an opening to the recess is defined along the first surface, the opening having a width less than a maximum width of the mass of solder material disposed within the recess such that the mass of solder material is captured within the recess.

12. The combination of claim 11 , wherein the first contact comprises a conductive pin and the first portion comprises a first end of the pin, the pin extending through the substrate to the second surface where a length of the pin extends beyond the second surface.

13. The combination of claim 12 , where the first end of the pin extends beyond a floor of the recess and is at least partially embedded into the mass of solder material.

14. The combination of claim 13 , wherein the first end of the pin terminates prior to the opening of the recess along the first surface.

15. The combination of claim 11 , wherein the mass of solder material is selected from the group consisting of a solder ball, a segment of solder wire, a solder slug, and a solder block.

16. The combination of claim 11 , wherein the recess includes a floor through which the first contact extends.

17. The combination of claim 11 , wherein the electronic device comprises a printed circuit board (PCB) and the second contact comprises a contact pad formed along the surface thereof.

18. The combination of claim 17 , wherein the surface of the PCB is a planar surface that seats against the first surface of the connector.

19. The combination of claim 11 , wherein the reflowed mass of solder material defines a conductive bridge between the first contact and the second contact.

20. The combination of claim 17 , wherein the pin overlies the pad and reflow of the mass of solder material results in a conductive bridge being formed between the pin and the pad.

21. The combination of claim 17 , wherein the pin is in contact with the pad after reflow of the mass of solder material.

22. A combination of electrical components comprising:

an electrical connector comprising:

a substrate having a first surface and an opposing second surface, with a recess being formed in the first surface;

a first contact securely coupled to the substrate and having a first portion extending at least partially into the recess; and

a mass of solder material retainingly held in the recess such that the first portion of the first contact is in contact with the solder material; and

an electronic device having a second contact and a surface that faces the first surface of the substrate, the first and second contacts being aligned with one another and whereupon heating of the mass of solder material, the first and second contacts are securely attached to one another and form an electrical pathway therebetween,

wherein the recess includes a floor through which the first contact extends, and

wherein an opening to the recess is defined along the first surface, with a width of the opening being less than a width of the floor resulting in the mass of solder material being captured within the recess.