Electrode wire for solar cell
View Patent ↗A solar cell electrode wire includes a core material having a volume resistivity of not greater than about 2.3 μΩ·cm and a proof strength in the range of about 19.6 MPa to about 85 MPa, and a hot-dip solder plating layer disposed on a surface of the core material. The core material is preferably an annealed pure copper material having an oxygen content of not higher than about 20 ppm. The core material may be a clad material including an interlayer of aluminum and copper layers disposed on opposite surfaces of the interlayer.
1. A solar cell electrode wire before being soldered to a solar cell, comprising:
a core material composed of pure Cu having a Cu content of not less than 99.9 mass %, having a volume resistivity of not greater than about 2.3 μΩ·cm, and having a proof stress in a range of about 36.3 MPa to about 85 MPa; and
a hot-dip solder plating layer having a melting point of about 130° C. to about 300° C. and disposed on a surface of the core material.
2. A solar cell electrode wire according to claim 1 , wherein the core material is composed of an annealed pure copper material having an oxygen content of not greater than about 20 ppm.
3. A solar cell electrode wire according to claim 1 , wherein the core material has a recessed portion arranged along a longitudinal direction of the core material for storing molten solder and the hot-dip solder plating layer is located in the recessed portion.
4. A solar cell electrode wire according to claim 3 , wherein an opening width of the recessed portion as measured transversely of the core material is not less than about 90% of a width of the core material.
5. A solar cell electrode wire according to claim 1 , wherein the proof stress of the core material is in a range of about 36.3 MPa to about 49 MPa.
6. A solar cell electrode wire before being soldered to a solar cell comprising:
a core material made of a clad material including an interlayer and first and second surface layers disposed on opposite surfaces of the interlayer; and
a hot-dip solder plating layer having a melting point of about 130° C. to about 300° C. and disposed on a surface of the core material; wherein
the first surface layer and the second surface layer are composed of pure Cu having a Cu content of not less than 99.9 mass %;
the interlayer is composed of pure Al having an Al content of not less than 99.0 mass %; and
the core material has an average volume resistivity of not greater than about 2.3 μΩ·cm and has an average proof stress in a range of about 36.3 MPa to about 85 MPa.
7. A solar cell electrode wire according to claim 6 , wherein the first surface layer and the second surface layer are composed of the same material and have the same thickness.
8. A solar cell electrode wire according to claim 6 , wherein the first surface layer and the second surface layer are composed of an annealed pure copper material having an oxygen content of not greater than about 20 ppm.
9. A solar cell electrode wire according to claim 8 , wherein the interlayer has a thickness in a range of about 10% to about 50% of an entire thickness of the clad material.
10. A solar cell electrode wire according to claim 6 , wherein the core material has a recessed portion arranged along a longitudinal direction of the core material for storing molten solder and the hot-dip solder plating layer is located in the recessed portion.
11. A solar cell electrode wire according to claim 10 , wherein an opening width of the recessed portion as measured transversely of the core material is not less than about 90% of a width of the core material.
12. A solar cell electrode wire according to claim 6 , wherein the average proof stress of the core material is in a range of about 36.3 MPa to about 49 MPa.