Method of manufacturing an RFID antenna
In a method of manufacturing an antenna structure ( 16 ), the following steps are carried out: a) providing a process support ( 1 ), b) applying a process support coating ( 2 ) to a work surface ( 1 a ) of the process support ( 1 ), c) producing a negative ( 3 ) of the antenna structure in the process support coating ( 2 ) by removing corresponding regions of the process support coating along the contours of the antenna structure to be produced, d) introducing a release agent ( 4 ) into the negative antenna structure ( 3 ) of the process support coating, e) introducing an electrically conductive antenna material ( 5 ) into the negative antenna structure ( 3 ) of the process support coating ( 2 ), optionally followed by curing of the antenna material ( 5 ), f) joining the antenna material ( 5 ) to an antenna substrate ( 7 ) by means of an adhesive ( 6 ), and g) pulling the antenna structure ( 16 ) off the process support ( 1 ), said antenna structure being joined to the antenna substrate ( 7 ) and made of the antenna material ( 5 ).
1 . A method of manufacturing an antenna structure which method comprises:
a) providing a process support
b) applying a process support coating to a work surface of the process support
c) producing a negative of the antenna structure in the process support coating by removing corresponding regions of the process support coating along the contours of the antenna structure to be produced,
d) introducing a release agent into the negative antenna structure of the process support coating,
e) introducing an electrically conductive antenna material into the negative antenna structure of the process support coating, optionally followed by curing of the antenna material
f) joining the antenna material to an antenna substrate by means of an adhesive ( 6 ),
g) pulling the antenna structure off the process support said antenna structure being joined to the antenna substrate and made of the antenna material
2 . An antenna structure manufacturing method as claimed in claim 1 , wherein the release agent is also pulled off when the antenna structure is pulled off the process support
3 . An antenna structure manufacturing method as claimed in claim 1 , wherein the release agent remains on the process support and possibly on the process support coating when the antenna structure is pulled off the process support
4 . An antenna structure manufacturing method as claimed in claim 1 , wherein the process support and the release agent are electrically conductive, the process support coating is electrically insulating, the production of a negative of the antenna structure in the process support coating comprises removing corresponding regions of the process support coating, according to the antenna structure to be produced, down to the process support work surface, the release agent is applied to the process support work surface and the introduction of the electrically conductive antenna material into the negative antenna structure comprises electroplating the antenna material into the negative antenna structure.
5 . An antenna structure manufacturing method as claimed in claim 1 , wherein the introduction of an electrically conductive antenna material into the negative antenna structure of the process support coating comprises introducing a solder paste, melting the solder paste in order to distribute it uniformly in the negative antenna structure, and curing the molten solder paste.
6 . An antenna structure manufacturing method as claimed in claim 1 , wherein the process support is designed as a cylinder.
7 . A data carrier comprising an antenna structure which is manufactured as claimed in claim 1 .
8 . A data carrier as claimed in claim 7 , comprising a data carrier substrate which at the same time serves as antenna substrate.