IP Library Granted Patent US 7,701,728
Granted Patent B2
US 7,701,728 · App. 11/574,566 · Granted Apr 20, 2010

Electronic component module and radio comunications equipment

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Quick Facts
Patent No.
US 7,701,728
App. No.
11/574,566
Granted
Apr 20, 2010
Kind
B2
Abstract

An IC element 2 having an oscillation circuit and an amplification circuit is mounted on a wiring board 1 , the IC element 2 is covered with a sealing resin layer 4 having a window 4 a on an upper surface of the IC element 2 , and a shielding layer 5 is made to adhere to the sealing resin layer 4 and the window 4 a from above. In a simple configuration, the entrance of electromagnetic waves into the IC element 2 is reduced, which allows a transmission signal from the IC element 2 to be stabilized.

Claims (12)

1. An electronic component module comprising:

a wiring board;

an IC element on the wiring board;

a sealing resin layer covering the IC element, excluding a part of a surface, on the opposite side of the wiring board, of the IC element;

a shielding layer, wherein the shielding layer adheres to the sealing resin layer and a portion, which is not covered with the sealing resin layer, of the IC element, wherein the portion comprises the center of the IC element,

wherein the shielding layer comprises one or more metal powders or a metal film,

a filter element comprising an LC resonance circuit in the wiring board, and

a shielding conductor pattern in the wiring board positioned between the filter element and the IC element,

wherein the outer periphery of the shielding layer has an extension extended to a portion below the upper surface of the wiring board along the side surface of the sealing resin layer, and a lower end of the extension is arranged at a height position equal to or less than the shielding conductor pattern.

2. A radio communication equipment comprising the electronic component module according to claim 1 , and an antenna and a transmitting/receiving circuit that are connected to the electronic component module.

3. The electronic component module according to claim 1 , wherein the shielding layer further comprises resin, and the one or more metal powders are dispersed in the resin.

4. The electronic component module according to claim 1 , if wherein the shielding layer covers the filter element.

Assignments (2)
MERGER Recorded Dec 19, 2017
From: KYOCERA CRYSTAL DEVICE CORPORATION
To: KYOCERA CORPORATION
Reel/Frame 044427/0209 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 1, 2007
From: HATANAKA, HIDEFUMI; TANIGUCHI, TOMOHIKO
To: KYOCERA CORPORATION; KYOCERA KINSEKI CORPORATION
Reel/Frame 018948/0820 →