Semiconductor light emitting device, lighting module, illumination apparatus, surface mount LED, and bullet LED
View Patent ↗Disclosed is a semiconductor light emitting device ( 10 ) that includes an LED chip ( 14 ) mounted on a base substrate ( 12 ) and a phosphor ( 16 ) covering the LED chip ( 14 ). The LED chip ( 14 ) is substantially in the shape of a regular hexagonal prism and the phosphor ( 16 ) is substantially in the shape of a cylinder. The phosphor ( 16 ) is so disposed that the axis of the cylinder substantially coincides with the axis of the prism.
1. A semiconductor light emitting device comprising:
a light emitting element having a semiconductor multilayer structure that includes a light emission layer and is substantially in a shape of a regular hexagonal prism with a substantially regular hexagonal cross section; and
a phosphor that is substantially in a shape of a cylinder and disposed to cover a main surface and lateral surfaces of the light emitting element, wherein
the light emitting element has such a size that the substantially regular hexagonal cross section measures 2.8 mm or less in a longest diagonal, and
d 2 /d 1 ≦1.4 is satisfied, where
d 1 denotes a corner thickness of the phosphor that is measured from a corner of the substantially regular hexagonal prism along a line connecting the corner and a center of the substantially regular hexagonal cross section, and
d 2 denotes a lateral thickness of the phosphor that is a largest thickness measured from a point on a side of the substantially regular hexagonal prism along a perpendicular bisector of the side.
2. The semiconductor light emitting device according to claim 1 , wherein
the phosphor is disposed so that an axis of the cylinder substantially coincides with an axis of the prism.
3. The semiconductor light emitting device according to claim 2 , wherein
a right section of the prism is substantially in a regular hexagonal shape of which a polygon diameter measures at least 1.4 mm.
4. The semiconductor light emitting device according to claim 3 , wherein
the light emitting element is an LED chip having a light-transmitting single crystal substrate on which the semiconductor multilayer structure is epitaxially grown,
the semiconductor light emitting device further comprises:
a base substrate on which the LED chip is flip-chip mounted and having a first power supply terminal and a second power supply terminal connected to a p-electrode and an n-electrode of the LED chip, respectively, and
the phosphor is partly supported by the base substrate.
5. The semiconductor light emitting device according to claim 1 , wherein
a right section of the prism is substantially in a regular hexagonal shape of which a polygon diameter measures at least 1.4 mm.
6. The semiconductor light emitting device according to claim 5 , wherein
the light emitting element is an LED chip having a light-transmitting single crystal substrate on which the semiconductor multilayer structure is epitaxially grown,
the semiconductor light emitting device further comprises:
a base substrate on which the LED chip is flip-chip mounted and having a first power supply terminal and a second power supply terminal connected to a p-electrode and an n-electrode of the LED chip, respectively, and
the phosphor is partly supported by the base substrate.
7. The semiconductor light emitting device according to claim 1 , wherein
the light emitting element is an LED chip having a light-transmitting single crystal substrate on which the semiconductor multilayer structure is epitaxially grown,
the semiconductor light emitting device further comprises:
a base substrate on which the LED chip is flip-chip mounted and having a first power supply terminal and a second power supply terminal connected to a p-electrode and an n-electrode of the LED chip, respectively, and
the phosphor is partly supported by the base substrate.
8. An illumination module comprising:
a mounting substrate; and
the semiconductor light emitting device of claim 1 mounted on the mounting substrate.
9. An illumination apparatus comprising as a light source the illumination module of claim 8 .
10. A surface mount LED comprising the semiconductor light emitting device of claim 1 , wherein
the light emitting element is an LED chip.
11. A bullet LED comprising the semiconductor light emitting device of claim 1 , wherein
the light emitting element is an LED chip.