Method Of Making Grating Structures Having High Aspect Ratio
A method for realizing a grating structure including the steps of providing a layered structure having a substrate, a grating layer, a first masking layer of polysilicon, a dielectric layer and a second masking layer. Additionally, a resist layer is deposited on the second masking layer; the resist layer is exposed according to a selected pattern to an electron beam; the resist layer is developed according to the pattern; the second masking layer is etched using the developed resist layer as a mask to form a patterned second masking layer; the dielectric layer is etched using the patterned second masking layer as a hard mask to form a patterned dielectric layer; the first masking layer is etched using the patterned dielectric layer as a hard mask to form a patterned first masking layer; and the grating layer is etched using the patterned first masking layer as a hard mask to form the grating structure.
1 - 34 . (canceled)
35 . A method for making a grating structure, comprising the following steps:
providing a layered structure comprising a substrate, a grating layer, a first masking layer comprising polysilicon, a dielectric layer and a second masking layer;
depositing a resist layer on the second masking layer;
exposing the resist layer to an electron beam according to a selected pattern;
developing the resist layer according to the pattern;
etching the second masking layer using the developed resist layer as a mask, to form a patterned second masking layer;
etching the dielectric layer using the patterned second masking layer as a hard mask, to form a patterned dielectric layer;
etching the first masking layer using the patterned dielectric layer as a hard mask, to form a patterned first masking layer; and
etching the grating layer using the patterned first masking layer as a hard mask to form the grating structure.
36 . The method according to claim 35 , wherein said second masking layer comprises polysilicon.
37 . The method according to claim 35 , comprising the step of removing the remaining portions of said resist layer before etching said first masking layer.
38 . The method according to claim 35 , comprising the step of removing the remaining portions of said patterned first masking layer after the etching of said grating layer.
39 . The method according to claim 35 , wherein said grating layer comprises silicon based materials.
40 . The method according to claim 35 , wherein said dielectric layer comprises silicon dioxide.
41 . The method according to claim 35 , wherein the grating layer is a waveguide layer.
42 . The method according to claim 41 , wherein said waveguide layer comprises silicon dioxide.
43 . The method according to claim 41 , wherein said waveguide layer comprises a bottom cladding layer, a core layer and a top cladding layer.
44 . The method according to claim 35 , wherein said grating structure comprises a plurality of slits, said slits having a depth of at least 10 μm.
45 . The method according to claim 35 , wherein said grating structure has an aspect ratio of not less than 10:1.
46 . The method according to claim 45 , wherein said grating structure has an aspect ratio of not less than 20:1.
47 . The method according to claim 35 , wherein said grating structure comprises a plurality of slits, said slits having a width not larger than 0.75 μm.
48 . The method according to claim 35 , wherein the thickness of said first masking layer is 2 to 5 μm.
49 . The method according to claim 35 , wherein the thickness of said dielectric layer is 100 nm to 1 μm.
50 . The method according to claim 35 , wherein the thickness of said second masking layer is 100 nm to 1 μm.
51 . The method according to claim 35 , comprising the step of reducing the roughness of said second masking layer before depositing said resist layer.
52 . The method according to claim 51 , wherein said step of reducing the roughness of said second masking layer comprises the sub-steps of:
depositing a photoresist layer on said second masking layer so that a top surface of said second masking layer is partially covered by said photoresist layer; and
etching portions of said second masking layer which are not covered by said photoresist layer.
53 . The method according to claim 52 , wherein in the sub-step of etching the portion of said masking layer, the etching rate of said second masking layer is higher than the etching rate of said photoresist layer.
54 . The method according to claim 52 , comprising the sub-step of etching said photoresist layer and portions of said second masking layer which progressively emerge from the photoresist layer, after the sub-step of etching the portions of said second masking layer which are not covered by the photoresist layer.
55 . The method according to claim 54 , wherein in said sub-step of etching said photoresist layer and portions of said second masking layer which progressively emerge from the photoresist layer, the etch rate of said second masking layer is higher than the etch rate of said photoresist layer.
56 . The method according to claim 52 , comprising the step of removing residues of said photoresist layer.
57 . An optical wavelength selective filter comprising a grating structure made according to claim 35 .
58 . A layered structure, comprising:
a substrate;
a grating layer located on said substrate;
a first masking layer comprising polysilicon located on the grating layer, the thickness of said first masking layer being 2 to 5 μm;
a dielectric layer located on said first masking layer, the thickness of said dielectric layer being 100 nm to 1 μm; and
a second masking layer located on said dielectric layer, the thickness of said second masking layer being 100 nm to 1 μm.
59 . The layered structure according to claim 58 , wherein said second masking layer comprises polysilicon.
60 . The layered structure according to claim 58 , comprising a resist layer located on top of said second masking layer.
61 . The layered structure according to claim 58 , wherein the thickness of said second masking layer is not more than 500 nm.
62 . The layered structure according to claim 58 , comprising a configuration wherein a grating structure can be formed on at least one of the layers of the layered structures.
63 . The layered structure according to claim 58 , wherein said grating layer is a waveguide layer.
64 . The layered structure according to claim 62 , wherein said grating structure has a high aspect ratio.
65 . A method for reducing the surface roughness of a polysilicon layer, comprising the steps of:
depositing a photoresist layer over the polysilicon layer so that a top surface of said polysilicon layer is partially covered by said photoresist layer; and
etching portions of said polysilicon layer which are not covered by said photoresist layer, the etch rate of said polysilicon layer being higher than the etch rate of said photoresist layer.
66 . The method according to claim 65 , wherein the etch rate of the polysilicon is two times or above the etch rate of the photoresist.
67 . The method according to claim 65 , comprising the step of etching said photoresist layer and portions of said polysilicon layer which progressively emerge from the photoresist layer, after the step of etching the portions of said polysilicon layer which are not covered by the photoresist layer.
68 . The method according to claim 67 , wherein the etch rate of the polysilicon layer is higher than the etch rate of the photoresist layer.