Curable composition containing a silicon-containing group polymer, a titanium chelate and an amide wax
View Patent ↗[Problem] There is provided a curable composition having high thixotropy and satisfactory curability by use of a non-organotin catalyst. [Means to Solve] A curable composition comprising (A) a polyoxyalkylene polymer having a silicon-containing group being capable of crosslinking by forming siloxane bonds and/or a (meth)acrylate polymer having a silicon-containing group being capable of crosslinking by forming siloxane bonds, (B) a titanium chelate, and (C) an amide wax type thixotropy-imparting agent.
1. A curable composition comprising:
(A) a polyoxyalkylene polymer having a silicon-containing group being capable of crosslinking by forming siloxane bonds and/or a (meth)acrylate polymer having a silicon-containing group being capable of crosslinking by forming siloxane bonds,
(B) a titanium chelate represented by the following general formula (1) or (2), and
(C) an amide wax type thixotropy-imparting agent,
General formula (1):
wherein each of n R 1 s is independently a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, R 2 is hydrogen, A 1 is methoxy or ethoxy, A 2 methyl, n is 1, 2 or 3
General formula (2):
wherein R 2 , A 1 and A 2 are the same as defined above, R 4 is a substituted or unsubstituted divalent hydrocarbon group having 1 to 20 carbon atoms.
2. The curable composition according to claim 1 , wherein said polymer (A) is a polyoxypropylene polymer having a silicon-containing group being capable of crosslinking by forming siloxane bonds and/or a (meth)acrylate polymer having a silicon-containing group being capable of crosslinking by forming siloxane bonds.
3. The curable composition according to claim 2 , wherein the glass transition temperature of the polymer (A) is not more than 20° C.
4. The curable composition according to claim 3 , wherein with respect to 100 parts by weight of the polymer (A), the titanium chelate (B) is contained in an amount of from 0.1 to 20 parts by weight and the amide wax type thixotropy-imparting agent (C) is contained in an amount of from 0.1 to 20 parts by weight.
5. The curable composition according to claim 2 , wherein with respect to 100 parts by weight of the polymer (A), the titanium chelate (B) is contained in an amount of from 0.1 to 20 parts by weight and the amide wax type thixotropy-imparting agent (C) is contained in an amount of from 0.1 to 20 parts by weight.
6. The curable composition according to claim 1 , wherein the glass transition temperature of the polymer (A) is not more than 20° C.
7. The curable composition according to claim 6 , wherein with respect to 100 parts by weight of the polymer (A), the titanium chelate (B) is contained in an amount of from 0.1 to 20 parts by weight and the amide wax type thixotropy-imparting agent (C) is contained in an amount of from 0.1 to 20 parts by weight.
8. The curable composition according to claim 1 , wherein with respect to 100 parts by weight of the polymer (A), the titanium chelate (B) is contained in an amount of from 0.1 to 20 parts by weight and the amide wax type thixotropy-imparting agent (C) is contained in an amount of from 0.1 to 20 parts by weight.
9. The curable composition according to claim 1 , wherein n in the General formula (1) is 2.
10. The curable composition according to claim 1 , wherein the titanium chelate is titanium diisopropoxidebis(ethylacetoacetate).
11. A sealant comprising said curable composition according to claim 1 .
12. An adhesive comprising said curable composition according to claim 1 .
13. A sealant comprising said curable composition according to claim 2 .
14. A sealant comprising said curable composition according to claim 6 .
15. A sealant comprising said curable composition according to claim 3 .
16. An adhesive comprising said curable composition according to claim 2 .
17. An adhesive comprising said curable composition according to claim 6 .
18. An adhesive comprising said curable composition according to claim 3 .