Method of assembly and assembly thus made
View Patent ↗An assembly ( 100 ) is provided comprising a first chip ( 20 ) and a second chip ( 30 ) which are interconnected through solder connections. These comprise, at the first chip, an underbump metallization and a solder bump, and, at the second chip, a metallization. In this case the solder bump is provided as a fluid layer with a contact angle of less than 90° C., and an intermetallic compound is formed on the basis of the metallization at the second chip, and at least one element of the composition is applied as the solder bump.
1. A method of assembly of a first chip to a second chip comprising the steps of:
providing a plurality of bond pads at a surface of the first chip with a solder composition, said bond pads being provided with an underbump metallization;
providing the second chip, which, at a surface, has a plurality of bond pads on which a metallization is present;
assembling the first and the second chip, such that at least part of the bond pads of the first chip and the corresponding bond pads of the second chip face each other, and
forming electrical connections between the bond pads at the first and the second chip by heating,
wherein the solder composition is provided as a fluid layer on the underbump metallization, which layer makes a contact angle of less than 90° with the underbump metallization, and an intermetallic compound is formed on the basis of the metallization at the second chip and at least one element of the solder composition.
2. A method as claimed in claim 1 , wherein the metallization at the second chip has a surface flattened using electroplating of the metallization.
3. A method as claimed in claim 1 , wherein the first chip is provided with further bumps of a larger height on top of the solder composition, said first chip extending laterally beyond the second chip.
4. A method as claimed in claim 1 , wherein an alloying element of the solder composition is chosen from the group of Sn, In and Ge, and wherein the metallization at the second chip comprises an element chosen from the group of Au, Cu, Ni, Pd, Pt and Co.
5. A method as claimed in claim 4 , wherein the alloying element of the solder composition is Sn, and wherein the metallization at the second chip comprises an element chosen from the group of Au, Cu and Ni.
6. A method as claimed in claim 5 , wherein the underbump metallization on the bond pads of the first chip comprises nickel, and the bumps are provided by immersion of the first chip into a bath of a low-melting Sn alloy.
7. A method as claimed in claim 3 , wherein the underbump metallization on the bond pads of the first chip comprises copper.
8. A method of assembly of a first chip to a second chip comprising the steps of:
providing a plurality of bond pads at a surface of the first chip with a solder composition, said bond pads being provided with an underbump metallization;
providing the second chip, which, at a surface, has a plurality of bond pads on which a metallization is present;
assembling the first and the second chip, such that at least part of the bond pads of the first chip and the corresponding bond pads of the second chip face each other; and
forming electrical connections between the bond pads at the first and the second chip by heating,
wherein the solder composition is provided as a fluid layer on the underbump metallization which layer makes a contact angle of less than 90° with the underbump metallization, and an intermetallic compound is formed on the basis of the metallization at the second chip and at least one element of the solder composition, and
wherein the heating step is a thermode bonding step, wherein the first chip is heated to a temperature between 50 and 200° C., and the second chip is heated to a temperature suitable for the formation of the intermetallic compound.
9. An assembly of a first chip and a second chip, both of which comprise a semiconductor substrate and a surface with bond pads that are exposed in apertures in a passivation layer, said surfaces facing each other, and a plurality of bond pads on the first chip being electrically connected to corresponding bond pads at the second chip through a solder interconnection,
wherein the solder interconnection is a layer sandwiched between a first underbump metallization and a second metallization, which layer has a thickness that is smaller than that of the metallizations, an intermetallic compound being present at an interface of said layer and said second metallization.
10. An assembly as claimed in claim 9 , wherein the length of the solder interconnection is less than 50 μm.
11. An assembly as claimed in claim 9 , wherein the intermetallic compound is chosen from the group of AuSn and CuSn.
12. An assembly as claimed in claim 9 , wherein the first chip extends laterally beyond the second chip and is provided with bumps that are present on top of the solder interconnection layer.
13. The assembly of claim 9 , wherein the first chip and the second chip have semiconductor substrates with a same coefficient of thermal expansion.
14. The method of claim 1 , wherein the contact angle is less than 60 degrees.
15. The method of claim 1 , wherein the contact angle is less than 40 degrees.
16. The assembly of claim 9 , wherein the plurality of bond pads on the first chip have different sizes and the same thickness for underbump metallization.