Heat treatment for a panel and apparatus for carrying out the heat treatment method
View Patent ↗A heat treatment method is provided for a panel. The panel includes a plastic housing composition, in which semiconductor chips are embedded by their rear sides and edge sides, and the top sides of the semiconductor chips form a coplanar area with the plastic housing composition. The panel is fixed by its underside on a holder, and a temperature gradient (ΔT) is then generated between top side and the underside of the panel. The temperature gradient (ΔT) is then maintained for at least one delimited or selected time period. The panel is then cooled to room temperature (T R ).
1. A method for heat treating a panel, the method comprising:
providing a panel comprising a plastic housing composition, a plurality of semiconductor chips embedded in the plastic housing composition such that rear sides and edge sides of the semiconductor chips are disposed within the plastic housing composition and top sides of the semiconductor chips form a coplanar area with a top side of the plastic housing composition, wherein an underside of the panel is formed by the plastic housing composition;
fixing the underside of the panel to a holder;
generating a temperature gradient (ΔT) between the top side of the panel including the coplanar area and the underside of the panel;
maintaining the temperature gradient (ΔT) for at least a selected time period; and
cooling the panel to room temperature (T R );
wherein:
the generating of the temperature gradient (ΔT) includes placing the panel between two holders providing different sources of heat such that one of the top side and the underside of the panel is heated while the other of the top side and the underside of the panel is simultaneously cooled; and
the steps of generating and maintaining a temperature gradient (ΔT) between the top side of the panel and the underside of the panel and cooling the panel to room temperature (T R ) prior or soldering or application of any structure to the underside of the panel.
2. The method of claim 1 , wherein the fixing of the underside of the panel to the holder comprises mechanically fixing the underside of the panel to a planar holder.
3. The method of claim 1 , wherein the fixing of the underside of the panel to the holder comprises pneumatically holding the panel to a planar vacuum holder.
4. The method of claim 1 , wherein the fixing of the underside of the panel to the holder comprises pressing the panel onto a planar holder using press-on plates.
5. The method of claim 1 , wherein the generation of a temperature gradient (ΔT) between the top side of the panel including the coplanar area and the underside of the panel includes thermal irradiation of the top side of the panel.
6. The method of claim 1 , wherein the generation of a temperature gradient (ΔT) between the top side of the panel including the coplanar area and the underside of the panel includes heating the holder and cooling the top side of the panel.
7. The method of claim 6 , wherein the top side of the panel is cooled utilizing a gas flow or a liquid flow.
8. The method of claim 1 , wherein the generation of a temperature gradient (ΔT) between the top side of the panel including the coplanar area and the underside of the panel includes cooling the holder and heating the top side of the panel utilizing a gas flow or a liquid flow.
9. The method of claim 1 , wherein a selected amount of heat is provided to the panel such that a relaxation of material forming the panel is initiated.
10. The method of claim 1 , wherein a selected amount of heat is provided to the panel such that thermal stresses are prevented during cooling of the panel.
11. The method of claim 1 , wherein the temperature gradient (ΔT) is varied dynamically during the heat treatment of the panel.
12. A method for heat treating a panel, the method comprising:
providing a panel comprising a plastic housing composition, a plurality of semiconductor chips embedded in the plastic housing composition such that rear sides and edge sides of the semiconductor chips are disposed within the plastic housing composition and top sides of the semiconductor chips form a coplanar area with a top side of the plastic housing composition, wherein an underside of the panel is formed by the plastic housing composition;
fixing the underside of the panel to a holder;
generating a temperature gradient (ΔT) between the top side of the panel including the coplanar area and the underside of the panel;
maintaining the temperature gradient (ΔT) for at least a selected time period; and
cooling the panel to room temperature (T R );
wherein the steps of generating and maintaining a temperature gradient (ΔT) between the top side of the panel and the underside of the panel and cooling the panel to room temperature (T R ) are performed prior to any soldering or application of any structure to the underside of the panel.