Semiconductor device and method for fabricating the same
A gate electrode is formed on a semiconductor substrate containing silicon, then source/drain regions are formed in regions of the semiconductor substrate located to both sides of the gate electrode, and then a nickel alloy silicide layer is formed on at least either the gate electrode or the source/drain regions. In the step of forming the nickel alloy silicide layer, a nickel alloy film and a nickel film are sequentially deposited on the semiconductor substrate and thereafter subjected to heat treatment.
1. A semiconductor device comprising a CMOS portion and an eFUSE portion both on a semiconductor substrate, wherein
a first nickel alloy silicide layer is used for the CMOS portion,
a second nickel alloy silicide layer is used for the eFUSE portion,
the heat-resistant temperature of the first nickel alloy silicide layer is higher than that of the second nickel alloy silicide layer
the heat-resistant temperature of the first nickel alloy silicide layer is greater than or equal to 600° C., and the heat-resistant temperature of the second nickel alloy silicide layer is less than or equal to 500° C.
2. The semiconductor device of claim 1 further comprising
a gate electrode formed on the semiconductor substrate,
wherein the eFUSE portion is formed in a fine-line portion of the gate electrode.
3. The semiconductor device of claim 1 further comprising
a gate electrode formed on the semiconductor substrate, and
a contact formed on the gate electrode so as to be connected to the gate electrode,
wherein the eFUSE portion is formed in a portion of the gate electrode connected to the contact.
4. The semiconductor device of claim 1 , wherein
an alloyed metal contained in the first nickel alloy silicide layer is identical with an alloyed metal contained in the second nickel alloy silicide layer, and
a nickel alloy forming the first nickel alloy silicide layer has a lower nickel content than a nickel alloy forming the second nickel alloy silicide layer.
5. The semiconductor device of claim 1 , wherein
a nickel alloy forming the first nickel alloy silicide layer has a nickel content of less than or equal to 30 at %, and
a nickel alloy forming the second nickel alloy silicide layer has a nickel content of greater than or equal to 70 at %.
6. The semiconductor device of claim 1 , wherein
an alloyed metal contained in each of the first and second nickel alloy silicide layers is a metal capable of forming a silicide having a higher melting point than nickel silicide.
7. The semiconductor device of claim 1 , wherein
an alloyed metal contained in each of the first and second nickel alloy silicide layers is vanadium (V), molybdenum (Mo), cobalt (Co), niobium (Nb), tantalum (Ta), tungsten (W), zirconium (Zr), manganese (Mn), iron (Fe), iridium (Ir), ruthenium (Ru), rhodium (Rh), or hafnium (Hf).
8. The semiconductor device of claim 1 , wherein
the first and second nickel alloy silicide layers are each formed by siliciding a multilayer structure including a nickel alloy film and a nickel film, and
the nickel film contained in the multilayer structure forming the first nickel alloy silicide layer is thinner than the nickel film contained in the multilayer structure forming the second nickel alloy silicide layer.
9. The semiconductor device of claim 1 , wherein
the first and second nickel alloy silicide layers contain different alloyed metals, and
a melting point of the alloyed metal contained in the first nickel alloy silicide layer is higher than a melting point of the alloyed metal contained in the second nickel alloy silicide layer.