Method of fabricating a printhead integrated circuit with a nozzle chamber in a wafer substrate
View Patent ↗A method of fabricating a printhead integrated circuit includes the step of forming a first layer of a polymeric material on a substrate that incorporates drive circuitry. A heater element is formed on the first layer of polymeric material to be connected to the drive circuitry. A second layer of a polymeric material is formed on the heater element and the first layer such that the heater element is embedded in polymeric material. The polymeric layers are etched to define a plurality of radially extending bridging portions which terminate in a nozzle rim and a plurality of actuators which each extend between a respective pair of adjacent bridging portions and each terminate in a free end proximal to the rim. The substrate is etched so that the substrate and the actuators define a nozzle chamber in fluid communication with an ink ejection port defined by the nozzle rim.
1. A method of fabricating a printhead integrated circuit, the method comprising the steps of:
forming a first layer of a polymeric material on a substrate that incorporates drive circuitry;
forming a heater element on the first layer of polymeric material to be connected to the drive circuitry;
forming a second layer of a polymeric material on the heater element and the first layer such that the heater element is embedded in polymeric material;
etching the polymeric layers to define a plurality of radially extending bridging portions which terminate in a nozzle rim and a plurality of actuators which each extend between a respective pair of adjacent bridging portions and each terminate in a free end proximal to the rim; and
etching the substrate so that the substrate and the actuators define a nozzle chamber in fluid communication with an ink ejection port defined by the nozzle rim.
2. A method as claimed in claim 1 , in which the step of forming the first layer of polymeric material includes the steps of depositing a first layer of polytetrafluoroethylene and etching the first layer of polytetrafluoroethylene to define vias for the heater element.
3. A method as claimed in claim 2 , in which the step of forming the heater element includes the steps of depositing, masking and etching metal on the first layer of polytetrafluoroethylene.
4. A method as claimed in claim 3 , in which the step of forming the second layer of polymeric material includes the steps of depositing a second layer of polytetrafluoroethylene and etching the second layer of polytetrafluoroethylene.
5. A method as claimed in claim 1 , in which the step of forming the second layer of polymeric material includes the step of forming ink-wicking prevention formations about the nozzle rim.
6. A method as claimed in claim 1 , in which the step of etching the substrate includes the step of crystallographically etching the substrate on crystallographic planes such that the nozzle chamber tapers inwardly away from the polymeric layers.
7. A method as claimed in claim 1 , which includes the step of back-etching the substrate to define an ink inlet passage in fluid communication with the nozzle chamber.