Method of bonding an optical component
View Patent ↗A light source ( 2 ) and a connection base ( 1 ) are held with a predetermined gap, solder paste melted by the thermal energy of laser light is fed into the gap, and the light source ( 2 ) and the connection base ( 1 ) are bonded together via a solder layer ( 32 ).
1. A method of bonding an optical component, comprising:
holding a light source and a connection base for holding the light source, with a predetermined gap between the base and light source,
irradiating the connection base with laser light thereby heating the connection base before supplying a solder material to a position near the gap,
melting the solder material by thermal energy of laser light, and permitting the molten solder material to flow into the gap, and
bonding the light source and the connection base.
2. The method of bonding an optical component according to claim 1 , wherein the solder material includes particles having a higher melting point than the solder material.
3. The method of bonding an optical component according to claim 1 , wherein the gap is 5 μm to 100 μm in width.
4. The method of bonding an optical component according to claim 1 , wherein the solder material is low-temperature solder.