Printed circuit board, method of manufacturing a printed circuit board and electronic apparatus

1. A printed circuit board comprising:

a wiring board that has at least one through hole;

a through-hole mount device which has a lead and which is mounted on a first surface of the wiring board, with the lead soldered in one of the at least one through holes, said lead having a distal end lying in the through hole; and

a surface mount device which is soldered to a second surface of the wiring board and which closes the through hole in which the lead is inserted, said second surface being opposite to the first surface.

2. The printed circuit board according to claim 1 , wherein the distal end of the lead lying in the through hole is spaced from the surface mount device.

3. The printed circuit board according to claim 2 , wherein solder fills a gap between the surface mount device and the distal end of the lead.

4. The printed circuit board according to claim 1 , wherein the wiring board has lands surrounding the through hole in which the lead is inserted and the lands are electrically connected to the through hole, and the surface mount device is soldered to the lands.

5. The printed circuit board according to claim 4 , wherein the wiring board further has pads provided adjacent to the lands, and the surface mount device is soldered to the lands and the pads.

6. A method of manufacturing a printed circuit board, comprising:

preparing a wiring board which has a first surface, a second surface opposite to the first surface, and at least one through hole, each opening at the first and second surfaces;

holding the wiring board, with the first surface turned upward, and applying solder paste into at least one of the through holes, at the first surface of the wiring board;

placing a surface mount device on the first surface, closing at least one of the through holes, and then mounting the surface mount device on the first surface by reflow-soldering;

turning the wiring board upside down, with the second surface turned upward, and applying solder paste into at least one through hole, at the second surface of the wiring board; and

inserting a lead of a through-hole mount device into one of the at least one through holes filled with the solder paste, from the second surface of the wiring board, and holding the lead in the through hole by reflow-soldering, with a distal end of the lead lying in the through hole.

7. The method according to claim 6 , wherein the solder paste fills a gap between the distal end of the lead and the surface mount device when the lead is inserted into one of the at least one through holes filled with the solder paste.

8. An electronic apparatus comprising:

a housing; and a printed circuit board which is provided in the housing and which includes:

(i) a wiring board that has at least one through hole;

(ii) a through-hole mount device which has a lead and which is mounted on a first surface of the wiring board, with the lead soldered in one of the at least one through holes, said lead having a distal end lying in the through hole; and

(iii) a surface mount device which is soldered to a second surface of the wiring board and which closes the through hole in which the lead is inserted, said second surface being opposite to the first surface.

9. The electronic apparatus according to claim 8 , wherein solder fills a gap between the surface mount device and the distal end of the lead.

10. The electronic apparatus according to claim 8 , wherein the printed circuit board includes adhesive which secures the through-hole mount device to the wiring board.