IP Library Granted Patent US 8,456,307
Granted Patent B2
US 8,456,307 · App. 11/587,240 · Granted Jun 4, 2013

Method for producing sheet with IC tags, apparatus for producing sheet with IC tags, sheet with IC tags, method for fixing IC chips, apparatus for fixing IC chips, and IC tag

Inventors: Hiroshi Suguro (Tsukuba, JP); Hideto Sakata (Akishima, JP); Terunao Tsuchiya (Matsudo, JP); Takaichi Shimomura (Tsukuba, JP)
Assignee: Dai Nippon Printing Co., Ltd.
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Quick Facts
Patent No.
US 8,456,307
App. No.
11/587,240
Granted
Jun 4, 2013
Kind
B2
Abstract

A method of producing a sheet 1 with IC tags comprises the steps of: preparing and feeding a sheet 21 a with electrical conductors formed thereon; providing an adhesive 18 on the sheet 21 a with electrical conductors; preparing multiple IC chips 20 and successively feeding the IC chips 20 ; successively arranging each IC chip 20 on the electrical conductors 22 of the sheet 21 a ; and fixing each IC chip 20 onto the electrical conductors 22 through the adhesive 18 . The sheet 21 a with electrical conductors formed thereon includes a non-conductive sheet 21 and a pair of electrical conductors 22 . The pair of electrical conductors 22 of the sheet 21 a with the electrical conductors are provided on the non-conductive sheet 21 , extend in the feed direction, and are spaced apart from each other.

Claims (10)

1. A sheet with IC tags, comprising:

a non-conductive sheet extending in an elongated fashion;

multiple pairs of electrical conductors provided on the non-conductive sheet so as to be respectively spaced away from both ends in a width direction perpendicular to a longitudinal direction of the non-conductive sheet, and arranged along the longitudinal direction of the non-conductive sheet; and

IC chips each arranged on each pair of electrical conductors;

wherein through holes are formed in the non-conductive sheet such that each of the through holes extends, between each adjacent pair of IC chips, over a range narrower than a range defined between both ends in the width direction of the non-conductive sheet and extends along the width direction over at least the full width of each pair of electrical conductors.

2. An IC tag, comprising:

a non-conductive sheet;

a pair of extension electrodes provided on the non-conductive sheet, the extension electrodes being spaced apart from each other across a slit; and

an IC chip has a pair of electrodes electrically connected with the extension electrodes;

wherein the slit includes a pair of notches positioned between the pair of electrodes and entering up to the non-conductive sheet, and a rectangular portion provided between the notches and having a generally rectangular cross section.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 19, 2007
From: SUGURO, HIROSHI; SAKATA, HIDETO; TSUCHIYA, TERUNAO; SHIMOMURA, TAKAICHI
To: DAI NIPPON PRINTING CO., LTD.
Reel/Frame 019196/0932 →
Priority Claims (2)
JP 2004-131340 · Apr 27, 2004 · national
JP 2005-025239 · Feb 1, 2005 · national
Continuity (1)
Related Publication 20070284759A1 · Dec 13, 2007