Electronics module and method for manufacturing the same
View Patent ↗This publication discloses an electronics module and a method for manufacturing it. The electronics module includes at least one component ( 6 ) embedded in an insulating-material layer ( 1 ), which has a first contacting surface, in which there are first contact terminals ( 7 ), from which the component ( 6 ) is connected electrically to the conductor structures contained in the electronics module. In addition, the component ( 6 ) has a second contacting surface opposite to the first contacting surface, in which there is at least one second contact terminal ( 7 ′), from which the component ( 6 ) is connected electrically to the conductor structures contained in the electronics module. With the aid of the invention, it is possible to achieve an electronic-module construction that saves space compared to the prior art.
1. A method for manufacturing an electronics module, in which method at least one component, which has a first contacting surface, in which there are first contact terminals, is embedded inside an insulating-material layer comprising two opposing surfaces, and contacts are made to connect the component electrically from the contact terminals to the conductor structures contained in the electronics module, and the component has a contacting surface opposite to the first contacting surface, in which there is at least one second contact terminal, and contacts are made to electrically connect the component from the contact terminal to the conductor structures contained in the electronics module such that a first conductor layer is arranged on the first surface and a second conductor layer on the second surface of the insulating-material layer and at least one second contact terminal of the component is electrically connected to the second conductor layer, with the aid of conductor material arranged in a contacting hole arranged to the second surface of the insulating-material layer, and wherein the insulating-material layer is a unified layer, consisting of essentially the same material and the distance of the contact surface of the second contact terminal to the patterned conductor structures situated on the second surface of the insulating-material layer is less than the diameter of the contacting hole and the first contacting surface of the component is glued to the first conductor layer.
2. A method according to claim 1 , wherein contacting holes and/or alignment holes are made in the first conductor layer before it is arranged on the first surface of the insulating-material layer.
3. A method according to claim 1 , and wherein at least part of the insulating-material layer is put on the electronics module after the gluing of the component.
4. A method according to any one of claims 1 , 2 and 3 , and in which the insulating-material layer is formed of at least two separate material sheets, which are pressed together to form a single unified insulating-material layer.
5. A method according to any one of claims 1 , 2 and 3 , and in which vias are made to connect the conductor layers electrically to each other.
6. A method according to any one of claims 1 , 2 and 3 , and in which there are at least two second contact terminals.
7. A method according to any one of claims 1 , 2 and 3 , and in which at least one second contact terminal is intended to conduct a ground-place potential, signal voltage, or power voltage to the component.
8. A method according to any one of claims 1 , 2 and 3 and in which there are at least four second contact terminals.