IP Library Granted Patent US 7,619,493
Granted Patent B2
US 7,619,493 · App. 11/590,804 · Granted Nov 17, 2009

Bulk acoustic resonator and filter element

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Quick Facts
Patent No.
US 7,619,493
App. No.
11/590,804
Granted
Nov 17, 2009
Kind
B2
Abstract

A bulk acoustic resonator has an acoustic reflector portion formed on a substrate and including one or more low acoustic impedance layers and one or more high acoustic impedance layers having a higher acoustic impedance than the low acoustic impedance layer which are disposed in stacked relation and an acoustic resonator portion formed on the acoustic reflector portion and having a piezoelectric film. At least one of the low acoustic impedance layers is made of silicon.

Claims (20)

1. A bulk acoustic resonator comprising:

an acoustic reflector portion formed on a substrate and including one or more low acoustic impedance layers and one or more high acoustic impedance layers having a higher acoustic impedance than the low acoustic impedance layer which are disposed in stacked relation; and

an acoustic resonator portion formed on the acoustic reflector portion and having a piezoelectric film, wherein

at least one of the low acoustic layers is made of silicon, and

the high acoustic impedance layer is made of HfO 2-x N x (0<x<2).

2. The bulk acoustic resonator of claim 1 , wherein at least one of the low acoustic impedance layers made of silicon is doped with an impurity.

3. The bulk acoustic resonator of claim 1 , wherein at least one of the low acoustic impedance layers made of silicon is porosified.

4. The bulk acoustic resonator of claim 1 , wherein at least one of the low acoustic impedance layers made of silicon is made of amorphous silicon.

5. The bulk acoustic resonator of claim 1 , further comprising:

a first buffer layer formed between the substrate and the acoustic reflector portion.

6. The bulk acoustic resonator of claim 1 , further comprising:

a second buffer layer formed between the acoustic reflector portion and the acoustic resonator portion.

7. The bulk acoustic resonator of claim 6 , wherein the second buffer layer is made of aluminum nitride, titanium, ruthenium, or iridium of which a crystal is C-axis oriented.

8. The bulk acoustic resonator of claim 1 , wherein an uppermost layer of the acoustic reflector portion is the low acoustic impedance layer made of silicon having portions thereof forming an insulator.

9. A filter element comprising:

an acoustic reflector portion formed on a substrate and having a low acoustic impedance layer including at least one layer made of silicon and a high acoustic impedance layer having a higher acoustic impedance than the low acoustic impedance layer; and

a plurality of acoustic resonator portions each formed on the acoustic reflector portion and having a lower electrode, a piezoelectric film, and an upper electrode which are formed successively in an ascending order, wherein

at least two of said plurality of acoustic resonator portions have the respective lower electrodes independent of each other,

a resistance value between the independent lower electrodes is not less than 500 Ω, and

the high acoustic impedance layer is made of HfO 2-x N x (0<x<2).

Assignments (2)
CHANGE OF NAME Recorded Nov 24, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021897/0689 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 12, 2007
From: UNO, TAKASHI; TSURUMI, NAOHIRO; YAHATA, KAZUHIRO; SAKAI, HIROYUKI
To: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Reel/Frame 019152/0516 →