IP Library Granted Patent US 7,727,824
Granted Patent B2
US 7,727,824 · App. 11/591,584 · Granted Jun 1, 2010

Liquid crystal display device and fabricating method thereof

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Quick Facts
Patent No.
US 7,727,824
App. No.
11/591,584
Granted
Jun 1, 2010
Kind
B2
Abstract

A liquid crystal display device may comprise a semiconductor layer on a substrate and including a channel portion and ohmic contact portions at both sides of the channel portion, wherein an edge portion of the semiconductor layer has a side surface of a substantially tapered shape; a gate insulating layer covering the semiconductor layer; a gate electrode on the gate insulating layer and substantially corresponding to the channel portion; source and drain electrodes contacting the semiconductor layer; and a pixel electrode contacting the drain electrode.

Claims (13)

1. A method of fabricating a liquid crystal display device, comprising:

forming a poly-crystalline silicon layer on a substrate;

forming a photoresist pattern on the poly-crystalline silicon layer;

simultaneously dry-etching the poly-crystalline silicon layer and ashing the photoresist pattern using hydrogen bromide gas, chlorine gas, sulfur hexafluoride gas, Br 2 , and oxygen gas to form a semiconductor layer, wherein an edge portion of the semiconductor layer has a side surface of a substantially tapered shape;

forming a gate insulating layer covering the semiconductor layer;

forming a gate electrode on the gate insulating layer;

forming a channel portion and ohmic contact portions in the semiconductor layer, the ohmic contact portions being disposed at both sides of the channel portion;

forming source and drain electrodes contacting the semiconductor layer; and

forming a pixel electrode contacting the drain electrode.

2. The method according to claim 1 , wherein the side surface has an angle θ 2 of about 30 to about 60 degrees with respect to a plane of the substrate.

3. The method according to claim 1 , wherein forming the ohmic contact portions includes doping the semiconductor layer with n+ or p+-ions using the gate electrode as a doping mask after forming the side surface of the tapered shape.

4. The method according to claim 1 , wherein the gate insulating layer has substantially a uniform thickness.

5. The method according to claim 1 , wherein forming the semiconductor layer includes forming lightly doped drain portions substantially between the channel portion and the ohmic contact portions.

Assignments (2)
CHANGE OF NAME Recorded Oct 17, 2008
From: LG.PHILIPS LCD CO., LTD.
To: LG DISPLAY CO., LTD.
Reel/Frame 021763/0177 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 2, 2006
From: YANG, JOON YOUNG; OH, JAE YOUNG; KIM, SOOPOOL
To: LG.PHILIPS LCD CO., LTD.
Reel/Frame 018497/0289 →