LED light engine with applied foil construction
View Patent ↗An L.E.D. lamp assembly ( 20 ) includes an electrically insulative coating ( 24 ) disposed on a thermally conductive substrate ( 22 ). A plurality of light emitting diodes ( 26 ) are secured to the coating ( 24 ) and a circuit ( 40 ) is adhesively secured to the coating ( 24 ) in predetermined spaced lengths ( 42 ) along the coating ( 24 ) to establish discrete and electrically conductive spaced lengths ( 42 ) with the light emitting diodes ( 26 ) disposed between the spaced lengths ( 42 ). LED electrical leads ( 32 ) are secured to the spaced lengths ( 42 ) of the circuit ( 40 ) to electrically interconnect the light emitting diodes ( 26 ). The circuit ( 40 ) includes a foil tape ( 46 ) having an electrically conductive tape portion ( 48 ) and a coupling portion ( 50 ) disposed on the tape portion ( 48 ) for securing the foil tape ( 46 ) to the insulated substrate ( 22 ). Heat generated by the light emitting diodes ( 26 ) is transferred through the insulative coating ( 24 ) to the electrically and thermally conductive substrate ( 22 ) for dissipating the heat.
1. An electrically driven L.E.D. lamp assembly ( 20 ) comprising;
a substrate ( 22 ) being thermally conductive,
a coating ( 24 ) disposed on said substrate ( 22 ) and being electrically insulative for electrically isolating said substrate ( 22 ) and having a low thermal resistance for transferring heat to said substrate ( 22 ),
a plurality of light emitting diodes ( 26 ) secured to said coating ( 24 ) with each of said light emitting diodes ( 26 ) having a pair of LED electrical leads ( 32 ),
a circuit ( 40 ) being electrically conductive and disposed on said coating ( 24 ) in discrete and electrically conductive spaced lengths ( 42 ) spaced from one another by said coating ( 24 ),
a lead coupling agent ( 44 ) disposed about said LED electrical leads ( 32 ) and said circuit ( 40 ) for securing said LED electrical leads ( 32 ) to said circuit ( 40 ) to electrically interconnect said light emitting diodes ( 26 ),
said circuit ( 40 ) including a foil tape ( 46 ) electrically interconnecting said light emitting diodes ( 26 ) to one another and having a tape portion ( 48 ) and a coupling portion ( 50 ),
said tape portion ( 48 ) comprising a sheet of metal extending continuously along said predetermined lengths ( 42 ) spaced from one another by said coating ( 24 ) and being electrically conductive with said LED electrical leads ( 32 ) to electrically interconnect each of said LED electrical leads ( 32 ) to an LED electrical lead ( 32 ) of an adjacent light emitting diode ( 26 ), and
said coupling portion ( 50 ) disposed axially along said tape portion ( 48 ) between said tape portion ( 48 ) and said coating ( 24 ) to secure said tape portion ( 48 ) to said coating ( 24 ) whereby electricity driving said light emitting diodes ( 26 ) is conducted through said tape portion ( 48 ) between each of said interconnected light emitting diodes ( 26 ) and heat generated by said light emitting diodes ( 26 ) is transferred from said light emitting diodes ( 26 ) through said coating ( 24 ) to said substrate ( 22 ) for dissipating the heat.
2. An assembly as set forth in claim 1 wherein said substrate ( 22 ) is a metal.
3. An assembly as set forth in claim 2 wherein said substrate ( 22 ) is aluminum and has a substrate thickness (T 1 ) in the range of 1 to 2 millimeters for rigidity.
4. An assembly as set forth in claim 1 wherein said foil tape ( 46 ) has a foil width (W) being variable for controlling voltage drops across said foil tape ( 46 ).
5. An assembly as set forth in claim 1 wherein said tape portion ( 48 ) of said foil tape ( 46 ) has a foil thickness (T 3 ) in the range of 20 to 100 micrometers.
6. An assembly as set forth in claim 1 wherein said tape portion ( 48 ) of said foil tape ( 46 ) is plated for resisting corrosion.
7. An assembly as set forth in claim 1 wherein said coupling portion ( 50 ) of said foil tape ( 46 ) is a pressure sensitive adhesive.
8. An assembly as set forth in claim 1 wherein said coupling portion ( 50 ) of said foil tape ( 46 ) is a thermoset adhesive.
9. An assembly as set forth in claim 1 wherein said coating ( 24 ) has a coating thickness (T 2 ) in the range of 10 to 50 micrometers.
10. An assembly as set forth in claim 1 wherein each of said plurality of light emitting diodes ( 26 ) has a LED body ( 28 ) and a LED heat sink ( 30 ) for dissipating heat generated by said LED body ( 28 ) with said LED body ( 28 ) disposed on said LED heat sink ( 30 ) and said LED heat sink ( 30 ) disposed on said coating ( 24 ).
11. An assembly as set forth in claim 10 including a component coupling agent ( 34 ) disposed between said LED heat sink ( 30 ) of said light emitting diodes ( 26 ) and said coating ( 24 ) for securing said light emitting diode ( 26 ) to said coating ( 24 ) and being thermally conductive for transferring heat from said LED heat sink ( 30 ) to said coating ( 24 ).
12. An assembly as set forth in claim 1 including a plurality of ballast resistors ( 36 ) disposed on said coating ( 24 ) with each of said ballast resistors ( 36 ) having a pair of resistor electrical leads ( 38 ).
13. An assembly as set forth in claim 12 including a component coupling agent ( 34 ) disposed between each of said ballast resistors ( 36 ) and said coating ( 24 ) for securing said ballast resistors ( 36 ) to said coating ( 24 ).
14. An assembly as set forth in claim 13 wherein said lead coupling agent ( 44 ) is disposed about said resistor electrical leads ( 38 ) and said circuit ( 40 ) for securing said resistor electrical leads ( 38 ) to said circuit ( 40 ) to electrically interconnect said light emitting diodes ( 26 ) and said ballast resistors ( 36 ).
15. An electrically driven L.E.D. lamp assembly ( 20 ) comprising;
a substrate ( 22 ) being an aluminum alloy and having a substrate thickness (T 1 ) in the range of 1 to 2 millimeters for rigidity,
a coating ( 24 ) disposed on said substrate ( 22 ) and being electrically insulative for electrically isolating said substrate ( 22 ) and having a coating thickness (T 2 ) in the range of 10 to 50 micrometers and a low thermal resistance for transferring heat to said substrate ( 22 ),
a plurality of light emitting diodes ( 26 ) with each of said light emitting diodes ( 26 ) having a LED body ( 28 ) and a LED heat sink ( 30 ) for absorbing heat generated by said LED body ( 28 ) and a pair of LED electrical leads ( 32 ) with said LED body ( 28 ) disposed on said LED heat sink ( 30 ) and said LED heat sink ( 30 ) disposed on said coating ( 24 ),
a component coupling agent ( 34 ) disposed between said LED heat sink ( 30 ) of said light emitting diode ( 26 ) and said coating ( 24 ) for securing said light emitting diode ( 26 ) to said coating ( 24 ) and being thermally conductive for transferring heat from said LED heat sink ( 30 ) to said coating ( 24 ),
a plurality of ballast resistors ( 36 ) disposed on said coating ( 24 ) with each of said ballast resistors ( 36 ) having a pair of resistor electrical leads ( 38 ),
said component coupling agent ( 34 ) disposed between each of said ballast resistors ( 36 ) and said coating ( 24 ) for securing said ballast resistors ( 36 ) to said coating ( 24 ),
a circuit ( 40 ) being electrically conductive and disposed on said coating ( 24 ) in predetermined spaced lengths ( 42 ) along said coating ( 24 ) to establish discrete and electrically conductive spaced lengths ( 42 ) of said circuit ( 40 ) for preventing electrical conduction between said spaced lengths ( 42 ) and from said spaced lengths ( 42 ) to said LED heat sinks ( 30 ) and said ballast resistors ( 36 ),
a lead coupling agent ( 44 ) being electrically conductive and disposed about said LED electrical leads ( 32 ) and said circuit ( 40 ) for securing said LED electrical leads ( 32 ) to said spaced lengths ( 42 ) of said circuit ( 40 ) and disposed about said resistor electrical leads ( 38 ) and said circuit ( 40 ) for securing said resistor electrical leads ( 38 ) to said spaced lengths ( 42 ) of said circuit ( 40 ) to electrically interconnect said light emitting diodes ( 26 ) and said ballast resistors ( 36 ), and
said circuit ( 40 ) including a foil tape ( 46 ) electrically interconnecting said light emitting diodes ( 26 ) to one another and having a foil width (W) being variable for controlling voltage drops across said foil tape ( 46 ) and having a tape portion ( 48 ) and a coupling portion ( 50 ),
said tape portion ( 48 ) being a sheet of metal extending continuously along said spaced lengths ( 42 ) and spaced from one another by said coating ( 24 ) and electrically conductive with said LED electrical leads ( 32 ) to electrically interconnect each of said LED electrical leads ( 32 ) to an LED electrical lead ( 32 ) of an adjacent light emitting diode ( 26 ) and being bright tin plated for resisting corrosion and having a foil thickness (T 3 ) in the range of 20 to 100 micrometers, and
said coupling portion ( 50 ) being a pressure sensitive adhesive disposed axially along said tape portion ( 48 ) between said tape portion ( 48 ) and said coating ( 24 ) to adhere said tape portion ( 48 ) to said coating ( 24 ) whereby electricity driving said light emitting diodes ( 26 ) is conducted through said tape portion ( 48 ) between each of said interconnected light emitting diodes ( 26 ) and heat generated by said LED body ( 28 ) is absorbed by said LED heat sink ( 30 ) and transferred from said LED heat sink ( 30 ) through said thermally conductive component coupling agent ( 34 ) and through said coating ( 24 ) to said substrate ( 22 ) for dissipating the heat generated by said LED body ( 28 ).
16. A method of manufacturing an electrically driven L.E.D. lamp assembly ( 20 ) comprising the steps of;
disposing an electrically insulative coating ( 24 ) having a low thermal resistance on a thermally conductive substrate ( 22 ),
securing a plurality of light emitting diodes ( 26 ) to the coating ( 24 ) with each light emitting diode ( 26 ) having a pair of LED electrical leads ( 32 ),
disposing a coupling portion ( 50 ) axially along a tape portion ( 48 ) comprising sheets of metal to provide a foil tape ( 46 ),
securing the foil tape ( 46 ) to the coating ( 24 ) with the coupling portion ( 50 ) between the tape portion ( 48 ) and the coating ( 24 ) in predetermined discrete and electrically conductive spaced lengths ( 42 ) spaced from one another by the coating ( 24 ), and
securing the LED electrical leads ( 32 ) to the spaced lengths ( 42 ) of the foil tape ( 46 ) to electrically interconnect the light emitting diodes ( 26 ) to one another.
17. A method as set forth in claim 16 further defined as forming the electrically insulative coating ( 24 ) on a metal substrate ( 22 ).
18. A method as set forth in claim 17 further defined as forming the electrically insulating coating ( 24 ) on an aluminum substrate ( 22 ) having a substrate thickness (T 1 ) in the range of 1 to 2 millimeters for rigidity.
19. A method as set forth in claim 17 further defined as forming the electrically insulative coating ( 24 ) with a coating thickness (T 2 ) in the range of 20 to 100 micrometers.
20. A method as set forth in claim 16 further defined as disposing the coupling portion ( 50 ) on the tape portion ( 48 ) of the foil tape ( 46 ) having a variable width.
21. A method as set forth in claim 16 further defined as disposing the coupling portion ( 50 ) on the tape portion ( 48 ) having a foil thickness (T 3 ) in the range of 20 to 100 micrometers.
22. A method as set forth in claim 16 including the step of plating the tape portion ( 48 ) of the foil tape ( 46 ) for resisting corrosion.
23. A method as set forth in claim 16 further defined as disposing the coupling portion ( 50 ) being a pressure sensitive adhesive on the tape portion ( 48 ) of the foil tape ( 46 ).
24. A method as set forth in claim 16 further defined as disposing the coupling portion ( 50 ) being a thermoset adhesive on the tape portion ( 48 ) of the foil tape ( 46 ).
25. A method as set forth in claim 16 further defined as adhesively securing the plurality of light emitting diodes ( 26 ) to the coating ( 24 ) by disposing a thermally conductive adhesive between the coating ( 24 ) and a LED heat sink ( 30 ) of each light emitting diode ( 26 ) with each light emitting diode ( 26 ) having a LED body ( 28 ) disposed on the LED heat sink ( 30 ).
26. A method as set forth in claim 16 including the step of securing a plurality of ballast resistors ( 36 ) to the coating ( 24 ) with a thermally conductive adhesive with each ballast resistor ( 36 ) having a pair of resistor electrical leads ( 38 ).
27. A method as set forth in claim 26 including the step of securing the resistor electrical leads ( 38 ) to the spaced lengths ( 42 ) of the foil tape ( 46 ) with an electrically conductive material.