IP Library Granted Patent US 8,790,552
Granted Patent B2
US 8,790,552 · App. 11/593,498 · Granted Jul 29, 2014

Conductive wet coating composition and thin-film prepared therefrom

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Quick Facts
Patent No.
US 8,790,552
App. No.
11/593,498
Granted
Jul 29, 2014
Kind
B2
Abstract

A highly conductive wet coating composition including a molten salt and a highly conductive thin film prepared therefrom is provided. The highly conductive wet coating composition can be coated at room temperature and the thin film prepared therefrom has a good thin film characteristic and high conductivity.

Claims (41)

1. A conductive wet coating composition, comprising:

a conductive nanoparticle;

a molten salt comprising

a polymer compound represented by Formula 2;

where X 1 is a substituted or unsubstituted C 1 -C 10 alkylene group, a substituted or unsubstituted C 6 -C 30 arylene group, a substituted or unsubstituted C 1 -C 20 heteroalkylene group, or a substituted or unsubstituted C 4 -C 30 heteroarylene group;

X 2 is a sulfonate-based anion, a cyanate-based anion, a thiocyanate-based anion, or a carboxylate-based anion;

each of R 3 , R 4 , R 5 and R 6 is independently a hydrogen atom, a halogen atom, a carboxyl group, an amino group, a nitro group, a cyano group, a hydroxyl group, a substituted or unsubstituted C 1 -C 20 alkyl group, a substituted or unsubstituted C 1 -C 20 alkoxy group, a substituted or unsubstituted C 1 -C 20 silicon-containing group, a substituted or unsubstituted C 1 -C 20 fluorine-containing group, a substituted or unsubstituted C 2 -C 20 alkenyl group, a substituted or unsubstituted C 2 -C 20 alkynyl group, a substituted or unsubstituted C 1 -C 20 heteroalkyl group, a substituted or unsubstituted C 6 -C 30 aryl group, a substituted or unsubstituted C 7 -C 30 arylalkyl group, a substituted or unsubstituted C 5 -C 30 heteroaryl group, or a substituted or unsubstituted C 3 -C 30 heteroarylalkyl group; and

n is an integer in the range of 50 to 500;

a polymer binder; wherein

the conductive nanoparticle is at least one selected from the group consisting of a metal oxide nanoparticle, a metal nanoparticle, a surface-substituted metal nanoparticle and a semiconductor nanoparticle.

2. The conductive wet coating composition of claim 1 , wherein the amount of the molten salt is 10 to 100 parts by weight based on 100 parts by weight of the polymer binder.

3. The conductive wet coating composition of claim 1 , wherein the amount of the conductive nanoparticle is 20 to 70 parts by weight based on 100 parts by weight of the polymer binder.

4. The conductive wet coating composition of claim 1 , wherein the metal oxide nanoparticle is indium-tin oxide (ITO) or antimony-tin oxide (ATO).

5. The conductive wet coating composition of claim 1 , wherein the metal nanoparticle is Au, Ag, Cu, Pd, Pt, Ag/Pd or Al nanoparticle.

6. The conductive wet coating composition of claim 1 , wherein the surface-substituted metal nanoparticle is a particle represented by Formula 3:

where M is a metal elected from the group consisting of Au, Ag, Cu, Pd, Pt, Ag/Pd and Al;

Z is S or CN;

n is an integer in the range of 5 to 50; and

SPACER is an alkyl group having 2-50 carbon atoms, benzene, diphenyl, or hydrocarbon having 2-50 carbon atoms having at least one group selected from the group consisting of —CONH—, —COO—, —Si—, bis-(porphyrin), —CO— and —OH.

7. The conductive wet coating composition of claim 1 , wherein the semiconductor nanoparticle is CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe, HgTe, GaN, GaP, GaAs, InP or InAs.

8. The conductive wet coating composition of claim 1 , wherein the polymer binder is a mixture of conductive resin and nonconductive resin.

9. The conductive wet coating composition of claim 1 , further comprising a mixture of Al 2 O 3 and a soluble titanium precursor.

10. The conductive wet coating composition of claim 9 , wherein a weight ratio of the Al 2 O 3 to the soluble titanium precursor is 1:9 to 4:1.

11. The conductive wet coating composition of claim 9 , wherein the soluble titanium precursor is at least one selected from compounds represented by Formulas 4 through 7:

Ti(OR) 4   (4)

where R is independently CH 3 CO—CH═CHCH 2 —, C 2 H 5 OCO—CH═CHCH 2 —, —CH 2 CH 2 —COO—NH 4 + , —COR′, —CO(C 6 H 4 )COOR″, or C1-C10 alkyl group, wherein R′ is a substituted or unsubstituted C1-C10 alkyl group; R″ is a substituted or unsubstituted C1-C10 alkyl group;

where R is a substituted or unsubstituted C 1 -C 10 alkyl group, and R′ is a substituted or unsubstituted C 1 -C 10 alkyl group;

where R is a substituted or unsubstituted C 1 -C 10 alkyl group; and

where R 1 is a substituted or unsubstituted C 1 -C 10 alkyl group.

12. The conductive wet coating composition of claim 9 , wherein the soluble titanium precursor is selected from the groups represented by the following formulas:

wherein R is a C 1 -C 10 alkyl group.

13. The conductive wet coating composition of claim 1 , wherein

the conductive nanoparticle selected from the group consisting of CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe, HgTe, GaN, GaP, GaAs, InP and InAs.

14. The conductive wet coating composition of claim 1 , wherein the

polymer binder comprising conductive resin and nonconductive resin.

15. A conductive thin film prepared by coating and drying the conductive wet coating composition according to claim 1 .

16. An electrode comprising the conductive thin film according to claim 15 .

17. A switching contact device comprising the conductive thin film according to claim 15 .

18. An organic electroluminescent device including the conductive thin film according to claim 15 .

19. A method of preparing a conductive thin film, comprising coating the composition of claim 1 and drying the coated composition.

20. A method of preparing a conductive thin film, comprising coating the composition of claim 1 at room temperature and drying the coated composition.

Assignments (3)
MERGER Recorded Sep 21, 2012
From: SAMSUNG MOBILE DISPLAY CO., LTD.
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 029241/0599 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 18, 2008
From: SAMSUNG SDI CO., LTD.
To: SAMSUNG MOBILE DISPLAY CO., LTD.
Reel/Frame 022034/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2006
From: PARK, JONG-JIN; KIM, JAE-HWAN
To: SAMSUNG SDI CO., LTD. A CORPORATION ORGANIZED UNDER THE LAWS OF THE REPUBLIC OF KOREA
Reel/Frame 018549/0808 →