Electronic component
View Patent ↗An electronic component has an element, a pair of terminal portions which are disposed on the element, and an external covering material which covers a part of the terminal portions and the element. The electronic component is configured such that inclined portions are disposed on corner portions of a bottom surface and side surfaces of the external covering material, and the terminal portions are protruded from corner portions where the inclined portions and the bottom surface of the external covering material intersect.
1. An electronic component, comprising:
an element;
a pair of terminal portions, which are disposed on the element and folded back so as to enable surface mounting; and
an external covering material, which covers both the element and a part of the terminal portions,
wherein the pair of terminal portions are protruded from a bottom surface of the external covering material, respectively, and
wherein a distance from a corner portion where an extended surface of a side surface of the external covering material and an extended surface of the bottom surface of the external covering material intersect, to a position where the terminal portion is protruded from the external covering material 0.1 mm or more.
2. The electronic component according to claim 1 , wherein the pair of terminal portions increase in thickness to front edges.
3. The electronic component according to claim 1 , wherein the pair of terminal portions decrease in thickness to front edges.
4. The electronic component according to claim 1 , wherein the pair of terminal portions have reinforcing materials on non-mounting surfaces which are not surface-mounted.
5. The electronic component according to claim 4 , wherein the pair of terminal portions have the reinforcing materials on peripheral portions of the non-mounting surfaces which are not surface-mounted.
6. The electronic component according to claim 1 , wherein the element includes a dielectric body.
7. The electronic component according to claim 6 , wherein the dielectric body is a plurality of multilayered dielectric base bodies, and an internal electrode is buried in the dielectric base body.
8. The electronic component according to claim 7 , wherein the internal electrode includes at least one of silver and palladium.
9. The electronic component according to claim 8 , wherein the internal electrode substantially includes nickel, and the dielectric base body is an anti-reducing material.
10. The electronic component according to claim 1 , wherein the element is of plurality.
11. The electronic component according to claim 1 , wherein the terminal portion has a flexure absorbing portion.
12. The electronic component according to claim 11 , wherein the flexure absorbing portion is any shape of a curved surface, a wavy surface, and a folded portion, or a combination of these things.
13. The electronic component according to claim 1 , wherein the external covering material is the shape of a roughly cuboid or a roughly cube.
14. The electronic component according to claim 1 , wherein the external covering material has a convex portion on the bottom surface, and the pair of terminal portions are protruded from the convex portions, respectively.
15. The electronic component according to claim 1 , wherein the convex portion is of a roughly circular pillar shape.
16. The electronic component according to claim 1 , wherein the terminal portion substantially includes copper; and both the element and the terminal portion are connected by solder of which a melting point is 240 C or more.
17. The electronic component according to claim 1 , wherein the terminal portion includes 42 alloy.
18. An electronic component, comprising:
an element;
a pair of terminal portions, which are disposed on the element and folded back so as to enable surface mounting; and
an external covering material, which covers both the element and a part of the terminal portions,
wherein the pair of terminal portions are protruded from a bottom surface of the external covering material, respectively,
wherein the bottom surface of the external covering material has an inclined portion for connecting an arbitrary position on a side surface of the external covering material and an arbitrary position on the bottom surface of the external covering material; and
wherein the pair of terminal portions are protruded from the inclined portions or boundaries of the inclined portions and the bottom surface, respectively.
19. The electronic component according to claim 18 , wherein the inclined portion has a shape of a curved surface.
20. An electronic component, comprising:
an element;
a pair of terminal portions, which are disposed on the element and folded back so as to enable surface mounting; and
an external covering material, which covers both the element and a part of the terminal portions,
wherein the pair of terminal portions are protruded from a bottom surface of the external covering material, respectively, and
wherein the bottom surface of the external covering material has dent portion, and the pair of terminal portions are protruded from the dent portion, respectively.
21. The electronic component according to claim 20 , wherein the dent portion is a cut-in portion which is formed after both the element and the part of the terminal portions are covered with the external covering material.
22. An electronic component, comprising:
an element;
a pair of terminal which are disposed on the element and folded back so as to enable surface mounting; and
an external covering material, which covers both the clement and a part of the terminal portions,
wherein the pair of terminal portions are protruded from a bottom surface of the external covering material, respectively, and
wherein the pair of terminal portions are thick in such a manner that thickness on an outside of the external covering material is thicker than thickness in an inside of the external covering material.
23. A manufacturing method of an electronic component, comprising:
placing an element;
connecting a pair of terminal portions to the element;
placing the element to which the terminal portions are connected, in a metal mold;
pouring a melted external covering material into the metal mold, up to such level that the terminal portions are protruded from a bottom surface of the external covering material; and
solidifying the poured external covering material.
24. The manufacturing method of the electronic component according to claim 23 , wherein the external covering material is solidified with maintaining temperature of the terminal portion at lower temperature than ambient temperature.