IP Library Granted Patent US 7,508,282
Granted Patent B2
US 7,508,282 · App. 11/598,658 · Granted Mar 24, 2009

Coupling device with electro-magnetic compensation

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,508,282
App. No.
11/598,658
Granted
Mar 24, 2009
Kind
B2
Abstract

A coupling device with electro-magnetic compensation is provided. The coupling device includes a first substrate having a first signal line on a top surface of the first substrate and a second substrate having a second signal line on a top surface of the second substrate connected together with a bottom surface of the first substrate wherein the second signal line couples with the first signal line by a plurality of electrical-conductive through holes. One side of the first signal line lies a capacitor device parallel connected to a ground and the capacitor device plays the role of adjusting the amount of return loss, isolation capacity, and coupling effect so as to have transmitting speeds in first and second signal lines remain substantially the same and superior high frequency characteristics.

Claims (25)

1. A unitary coupling device with electro-magnetic compensation, comprising:

a first substrate having a first signal line on a top surface of the first substrate; said first signal line comprising an input end, coupling end, output end, and isolation end;

a second substrate having a second signal line on a top surface of the second substrate connected together with a bottom surface of the first substrate; wherein the second signal line couples with the first signal line by a plurality of electrically conductive through holes; and

a capacitor device connected electrically in parallel to a ground and connected on one side of the first signal line.

2. The unitary coupling device with electro-magnetic compensation in claim 1 , wherein the bottom surface of the second substrate connects to a multi-layer substrate and the first and second layers of the multi-layer substrate, includes an individual circuit layout.

3. The unitary coupling device with electro-magnetic compensation in claim 1 , wherein the capacitor device is an open stub.

4. The unitary coupling device with electro-magnetic compensation in claim 1 , wherein the capacitor device is in the form of a plurality of open stubs connected each with the other through wire bonding.

5. The unitary coupling device with electro-magnetic compensation in claim 1 , wherein the capacitor device is in the form of a plurality of open stubs connected each with the other through ribbon bonding.

6. The unitary coupling device with electro-magnetic compensation in claim 1 , wherein the capacitor device comprises at least one capacitor electrically connected to an electrically grounded open stub.

7. The unitary coupling device with electro-magnetic compensation in claim 6 , wherein the electrically grounded open stub includes at least one through hole electrically connected to the ground.

8. A unitary coupling device with electro-magnetic compensation, comprising:

a first substrate having a first signal line on a top surface of the first substrate; said first signal line comprising an input end, coupling end, output end, and isolation end;

a second substrate having a second signal line on a top surface of the second substrate connected together with a bottom surface of the first substrate wherein the second signal line is coupled in the form of a plurality of electrical-conductive through holes; and

a first capacitor device connected electrically in parallel to a ground, and a second capacitor device connected electrically in parallel to the ground, said first and second capacitor devices connected to the first signal line on opposite sides of the first signal line.

9. The unitary coupling device with electro-magnetic compensation in claim 8 , wherein the bottom surface of the second substrate connects to a multi-layer substrate and the first and second layers of the multi-layer substrate includes an individual circuit layout is with a circuitry layout individually.

10. The unitary coupling device with electro-magnetic compensation in claim 8 , wherein the first capacitor device is an open stub.

11. The unitary coupling device with electro-magnetic compensation in claim 8 , wherein the second capacitor device is an open stub.

12. The unitary coupling device with electro-magnetic compensation in claim 8 , wherein the first capacitor device comprises at least one capacitor electrically connected to a grounded open stub.

13. The unitary coupling device with electro-magnetic compensation in claim 12 , wherein the grounded open stub includes at least one through hole electrically connected to the ground.

14. The unitary coupling device with electro-magnetic compensation in claim 8 , wherein the second capacitor device comprises at least one capacitor electrically connected to a grounded open stub.

15. The unitary coupling device with electro-magnetic compensation in claim 14 , wherein the grounded open stub includes at least one through hole electrically connected to the ground.

16. The unitary coupling device with electro-magnetic compensation in claim 8 , wherein the first capacitor device is in the form of a plurality of open stubs connected each with the other through wire bonding.

17. The unitary coupling device with electro-magnetic compensation in claim 8 , wherein the first capacitor device is in the form of a plurality open stubs connected each with the other through ribbon bonding.

18. The unitary coupling device with electro-magnetic compensation in claim 8 , wherein the second capacitor device is in the form of a plurality of open stubs connected each with the other through wire bonding.

19. The unitary coupling device with electro-magnetic compensation in claim 8 , wherein the second capacitor device is in the form of a plurality of open stubs connected each with the other through ribbon bonding.

Assignments (2)
CHANGE OF NAME Recorded Apr 17, 2015
From: CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
To: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
Reel/Frame 035453/0240 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 21, 2006
From: KUO, JEN-I; LEE, JIH-HWA; DENG, JOSEPH D.S.
To: CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
Reel/Frame 018559/0292 →