Method of joining a plurality of reticles for use in producing a semiconductor layout pattern, a computerized system for implementing such a method and a semiconductor mask arrangement produced by implementing such a method
View Patent ↗A method for joining a plurality of reticles is used for producing a semiconductor layout pattern, so that the reticles will collectively map a circuit arrangement on a semiconductor substrate. A plurality of matching patterns is provided that are each geometrically linked to a respective particular reticle and through detecting pairwise correspondence among the matching patterns likewise correspondence among the associated reticles is ascertained. In particular, the method has bulk sub-reticles and peripheral sub-reticles, and a first matching pattern associates to a peripheral sub-reticle that abuts a bulk sub-reticle and a second matching pattern to the bulk sub-reticle at such distance therefrom that fitting of the peripheral sub-reticle between the second matching pattern and the bulk sub-reticle allows matching of the first and second matching patterns. The bulk sub-reticles are used to constitute an array of sub-reticles.
1. A method for joining a plurality of reticles for use in producing a semiconductor layout pattern, so that said reticles will collectively map a circuit arrangement on a semiconductor substrate whilst providing a plurality of matching patterns that are each geometrically linked to a respective particular reticle and through detecting pairwise correspondence among said matching patterns ascertaining likewise correspondence among the associated reticles,
said method being characterized by having bulk sub-reticles and peripheral sub-reticles, and associating a first matching pattern to a peripheral sub-reticle that abuts a bulk sub-reticle and a second matching pattern to the bulk sub-reticle at such distance therefrom that fitting of the peripheral sub-reticle between the second matching pattern and the bulk sub-reticle allows matching of the first and second matching patterns, and wherein respective bulk sub-reticles are used to constitute an array of sub-reticles.
2. A method as claimed in claim 1 , wherein said peripheral sub-reticles collectively abut at least two sides of said array.
3. A method as claimed in claim 1 , wherein said peripheral sub-reticles collectively abut at least three successive sides of said array.
4. A method as claimed in claim 1 , wherein said peripheral sub-reticles collectively abut all four sides of said array.
5. A method as claimed in claim 1 , wherein said peripheral sub-reticles collectively abut at least two successive sides of said array whilst thereby constituting a continuous margin strip.
6. A method as claimed in claim 1 and applied in two dimensions to an array of 2×n bulk sub-reticles wherein n is an integer equal to or greater than 2.
7. A method as claimed in claim 1 , wherein said peripheral sub-reticles collectively form a strip that surrounds said array.
8. A compound reticle comprising: sub-reticles; peripheral sub-reticles; and a plurality of matching patterns that are each geometrically linked to a respective sub-reticle, wherein a first matching pattern is associated with a first peripheral sub-reticle that abuts a first bulk sub-reticle at such distance therefrom that fitting of the first peripheral sub-reticle between the second matching pattern and the first bulk sub-reticle joins the first bulk sub-reticle to the first peripheral sub-reticle.