IP Library Granted Patent US 7,513,596
Granted Patent B2
US 7,513,596 · App. 11/599,335 · Granted Apr 7, 2009

Device for depositing layers of material to form 3-D objects

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Quick Facts
Patent No.
US 7,513,596
App. No.
11/599,335
Granted
Apr 7, 2009
Kind
B2
Abstract

A device for depositing layers of material to form three dimensional objects using a plurality of printheads that can print multiple layers simultaneously and different materials into the same layer, wherein some of the printheads can be maintained at a temperature that differs from the operating temperature of the other printheads.

Claims (21)

1. A device for depositing layers of material to form three dimensional objects, the device comprising:

a semiconductor memory for storing data that defines at least one layer; and

a plurality of printheads each capable of printing at least part of multiple layers simultaneously such that two or more different materials are printed in a single layer; wherein,

at least one of the printheads is maintained at a different temperature to at least one of the other printheads.

2. A device according to claim 1 wherein at least one of the printheads can print different materials.

3. A device according to claim 1 wherein at least one of the printheads prints different material to at least one of the other printheads.

4. A device according to claim 1 wherein more than 100 layers are printed simultaneously.

5. A device according to claim 1 wherein the printheads are fixed inkjet printheads that simultaneously print the full width of the products.

6. A device according to claim 1 wherein the printheads are configured such that at least one of the layers may be printed with a first set of materials and at least one other of the layers may be printed with a second set of materials, and

wherein the first and second sets are not the same.

7. A device according to claim 1 wherein at least one of the printheads is able to initially print at least part of a first layer an then dynamically reconfigure to print at least part of a second layer.

8. A device according to claim 7 wherein during use the at least one printhead dynamically reconfigures to print part of a second layer in response to the failure of at least one of the other printheads to complete printing the second layer.

9. A device according to claim 1 programmed to execute a process, including a plurality of subsystems, each of which performs a stage of the process,

each of the subsystems configured to perform one of a first subset of N 1 of the stages, where N is greater than 1 and to change the stage of the subset being performed on receipt of a change instruction;

wherein, in the event that one of the subsystems fails, at least one of the remaining subsystems synchronously changes to performing the respective stage of the failed subsystem without requiring transfer of data relating the respective stage to the said at least one remaining subsystems, and

when a subsystem changes to performing a different stage, the device reconfigures the subsystem to be capable of performing a second subset N 2 of the stages where N 1 and N 2 have the same number of stages.

10. A device according to claim 1 wherein at least one of the printheads prints a first material and another of the printheads prints a second material, the first material being cured by a first method and the second material being cured by a second method different to the first method.

11. A device according to claim 1 further comprising an object incorporation mechanism that incorporates inorganic semiconductors into the object while it is being printed.

12. A device according to claim 1 further comprising an object incorporation mechanism that incorporates non-printed objects into partially completed product, the non-printed objects not being printed by the printheads.

13. A device according to claim 1 further comprising an object incorporation mechanism that inserts at least one non-printed object into at least one cavity formed in the layers of printed material, the non-printed object being inserted while the printheads are printing layers.

14. A device according to claim 1 wherein at least one printhead is configured to print electrical connections to at least one object incorporated in the three dimensional object.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Aug 26, 2021
From: HSBC BANK USA, NATIONAL ASSOCIATION
To: 3D SYSTEMS, INC.
Reel/Frame 057651/0374 →
SECURITY INTEREST Recorded Feb 27, 2019
From: 3D SYSTEMS, INC.
To: HSBC BANK USA, NATIONAL ASSOCIATION, AS ADMINISTRATIVE AGENT
Reel/Frame 048456/0017 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 13, 2013
From: SILVERBROOK RESEARCH PTY LTD
To: 3D SYSTEMS, INC.
Reel/Frame 030404/0275 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 15, 2006
From: SILVERBROOK, KIA
To: SILVERBROOK RESEARCH PTY LTD
Reel/Frame 018604/0887 →