IP Library Patent Application 11602940
Patent Application
App. No. 11/602,940

Fluid encapsulant for protecting electronics

Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US None
App. No.
11/602,940
Abstract

An electronics module configured for use within a vehicle fuel tank. The electronics module includes a fluid encapsulant, and electronics immersed in the fluid encapsulant. Preferably, the electronics module includes a sealed housing for carrying the fluid encapsulant and electronics therein, and the fluid encapsulant includes a base fluid and additives to the base fluid to neutralize aggressive compounds in any fuel that may enter the sealed housing.

Claims (34)

1 . An electronics module configured for contact with liquid fuel in a fuel tank, comprising:

a fluid encapsulant; and

electronics immersed in the fluid encapsulant.

2 . The electronics module of claim 1 further comprising a sealed housing carrying the electronics therein.

3 . The electronics module of claim 2 wherein the sealed housing includes a first housing component, and a second housing component mechanically sealed to the first housing component.

4 . The electronics module of claim 3 wherein the second housing component is mechanically sealed to the first housing component using a polymeric, fluid-tight mechanical seal disposed between the first and second housing components.

5 . The electronics module of claim 1 wherein the electronics include a circuit board carrying a plurality of electronic devices.

6 . The electronics module of claim 5 wherein the plurality of electronic devices include at least one microprocessor.

7 . The electronics module of claim 5 wherein the electronics include controller electronics for a fuel pump assembly.

8 . The electronics module of claim 1 wherein the fluid encapsulant is a liquid encapsulant and wherein the liquid fuel will become suspended in and diluted by the liquid encapsulant if the liquid fuel enters the electronics module.

9 . The electronics module of claim 8 wherein the liquid encapsulant is based on at least one of organic or inorganic fluids.

10 . The electronics module of claim 9 wherein the liquid encapsulant is at least one of a transformer oil, a silicone fluid, or a fluourinert fluid.

11 . The electronics module of claim 1 wherein the encapsulant is based on at least one of an organic or inorganic gel or grease.

12 . The electronics module of claim 1 wherein the fluid encapsulant is a liquid encapsulant and includes an additive to neutralize corrosive compounds present in the liquid fuel.

13 . An electronics module of a fuel pump assembly, configured for contact with liquid fuel in a fuel tank, comprising:

a sealed housing;

a liquid encapsulant carried within the sealed housing; and

electronics carried within the housing and immersed in the liquid encapsulant.

14 . The sealed electronics module of claim 13 wherein the sealed housing is composed of a polymeric material.

15 . The electronics module of claim 13 wherein the sealed housing includes a first housing component, and a second housing component mechanically sealed to the first housing component.

16 . The electronics module of claim 15 wherein the second housing component is mechanically sealed to the first housing component using a polymeric, fluid-tight mechanical seal disposed between the first and second housing components.

17 . The electronics module of claim 13 wherein the electronics include a circuit board carrying a plurality of electronic devices.

18 . The electronics module of claim 17 wherein the plurality of electronic devices include at least one microprocessor.

19 . The electronics module of claim 17 wherein the electronics are controller electronics for a fuel pump assembly.

20 . The electronics module of claim 13 wherein the liquid encapsulant is based on at least one of organic or inorganic fluids.

21 . The electronics module of claim 20 wherein the liquid encapsulant is at least one of a transformer oil, a silicone fluid, or a fluourinert fluid.

22 . The electronics module of claim 13 wherein the encapsulant is based on at least one of an organic or inorganic gel or grease.

23 . The electronics module of claim 13 wherein the liquid encapsulant includes an additive to neutralize corrosive compounds present in fuel.

24 . A fuel pump assembly for use in a vehicle fuel tank, comprising:

a fuel pump motor; and

an electronics module in communication with the fuel pump motor and being configured for contact with liquid fuel in the vehicle fuel tank including:

a sealed housing;

a liquid encapsulant carried within the sealed housing; and

electronics carried within the housing and immersed in the liquid encapsulant.

Assignments (9)
TERMINATION AND RELEASE Recorded Jun 30, 2015
From: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: TI GROUP AUTOMOTIVE SYSTEMS, L.L.C.; TI AUTOMOTIVE LIMITED; TI AUTOMOTIVE CANADA, INC.; TI AUTOMOTIVE, L.L.C.; HANIL USA L.L.C.; TI GROUP AUTOMOTIVE SYSTEMS S DE R.L. DE C.V.
Reel/Frame 036013/0775 →
SECURITY AGREEMENT Recorded Mar 14, 2012
From: TI GROUP AUTOMOTIVE SYSTEMS, L.L.C.; TI AUTOMOTIVE LIMITED; TI AUTOMOTIVE CANADA, INC.; TI AUTOMOTIVE, L.L.C.; HANIL USA, L.L.C.; TI GROUP AUTOMOTIVE SYSTEMS S DE R.L. DE C.V.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 027864/0968 →
RELEASE OF SECURITY INTEREST Recorded Mar 14, 2012
From: CITIBANK, N.A.
To: TI GROUP AUTOMOTIVE SYSTEMS, L.L.C.
Reel/Frame 027865/0016 →
RELEASE AND TERMINATION OF PATENT SECURITY INTEREST Recorded Aug 26, 2010
From: WILMINGTON TRUST (LONDON) LIMITED (AS SUCCESSOR IN INTEREST TO JP MORGAN CHASE BANK, N.A.)
To: HANIL USA, L.L.C.; TI AUTOMOTIVE, L.L.C.; TI GROUP AUTOMOTIVE SYSTEMS, L.L.C.
Reel/Frame 024891/0671 →
ABL PATENT SECURITY AGREEMENT Recorded Aug 26, 2010
From: TI GROUP AUTOMOTIVE SYSTEMS, L.L.C.
To: CITIBANK N.A.
Reel/Frame 024895/0956 →
TERM PATENT SECURITY AGREEMENT Recorded Aug 26, 2010
From: TI GROUP AUTOMOTIVE SYSTEMS, L.L.C.
To: CITIBANK N.A.
Reel/Frame 024896/0057 →
ASSIGNMENT OF SECURITY INTEREST Recorded Mar 10, 2010
From: JP MORGAN CHASE BANK, N.A.
To: WILMINGTON TRUST (LONDON) LIMITED
Reel/Frame 024055/0633 →
SECURITY AGREEMENT Recorded Aug 24, 2007
From: HANIL USA, L.L.C.; TI AUTOMOTIVE, L.L.C.; TI GROUP AUTOMOTIVE SYSTEMS, L.L.C.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 019733/0933 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 21, 2006
From: KUPERUS, PETER P.
To: TI GROUP AUTOMOTIVE SYSTEMS, L.L.C.
Reel/Frame 018602/0169 →