IP Library Granted Patent US 7,530,669
Granted Patent B2
US 7,530,669 · App. 11/604,315 · Granted May 12, 2009

Printhead module with a micro-electromechanical integrated circuit configured to eject ink

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,530,669
App. No.
11/604,315
Granted
May 12, 2009
Kind
B2
Abstract

A printhead module is provided for an inkjet printhead assembly. The printhead module includes a support. An elongate carrier is mounted to the support. The carrier defines a plurality of transverse ribs and an ink channel located between the ribs. A subassembly includes a micro-electromechanical integrated circuit (IC) configured to eject ink. The subassembly is mounted to the carrier so that the support, carrier and subassembly define a plurality of sealed ink chambers which can feed ink to the IC via the ink channel.

Claims (12)

1. A printhead module for an inkjet printhead assembly, the printhead module comprising:

a support defining a plurality of internal ink chambers;

an elongate carrier mounted to the support, and defining a pair of sets of transverse ribs and an ink channel located between the sets; and

a subassembly including a micro-electromechanical integrated circuit (IC) configured to eject ink, the subassembly being mounted to the carder to seal the ink chambers, wherein ink is fed from the ink chambers to the IC via the ink channel.

2. A printhead module as claimed in claim 1 , wherein the support comprises a cover molding from which a plurality of clips extend for snap fitting the support to an ink reservoir.

3. A printhead module as claimed in claim 1 , wherein the elongate carrier comprises a micromolding.

4. A printhead module as claimed in claim 1 , wherein the subassembly further includes a Tape Automated Bond (TAB) film to which the IC is adhered and electrically connected.

5. A printhead module as claimed in claim 4 , wherein the TAB film is further mounted to the support to define a pair of TAB film portions obliquely oriented with respect to the support.

6. A printhead module as claimed in claim 1 , wherein opposite sides of the printhead module define complementary formations so that a pair of the printhead modules can be nested together.

7. A printhead module as claimed in claim 1 , wherein each ink chamber defines a filling funnel.

8. A printhead module as claimed in claim 7 , wherein a plurality of hydrophobic collars extend from the support to bound respective filling funnels.

9. A printhead module as claimed in claim 1 , wherein the support comprises a plurality of internal ribs which, in part, define the ink chambers.

Assignments (3)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 17, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028570/0121 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2006
From: SILVERBROOK, KIA; KING, TOBIN ALLEN; JACKSON, GARRY RAYMOND
To: SILVERBROOK RESEARCH PTY LTD
Reel/Frame 018622/0521 →