Solid-state image pickup device having improved light shielding characteristics and camera including the same
View Patent ↗Provided is a solid-state image pickup device capable of outputting fine quality image signals at high speed. Vertical transfer sections 40 and a distribution transfer section 20 have a common pattern of electrodes for each 2n+1 (n is an integer equal to or greater than 1) and comprise driving electrodes V 1 to V 6 , V 3 R, V 3 L, V 5 R, and V 5 L, to which driving pulses φV 1 to φV 6 , φV 3 R, φV 3 L, φV 5 R, and φV 5 L are applied. The driving electrodes V 1 , V 2 , V 4 , and V 6 are shared by all columns and the driving electrodes V 3 , V 3 R, V 3 L, V 5 R, and V 5 L are independent electrodes which are separated in an island-like manner. The distribution transfer section 20 controls, independently for each column, reading out signal charges from the vertical transfer sections 40 to the horizontal transfer section 10.
1. A solid-state image pickup device comprising:
a plurality of photo-detecting sections for generating signal charges;
a plurality of vertical transfer sections for transferring the signal charges in a vertical direction;
a horizontal transfer section for receiving the signal charges from the vertical transfer sections and transferring the received signal charges in a horizontal direction;
a distribution transfer section including a plurality of driving electrodes which are independently provided in a column direction in order to transfer the signal charges from the vertical transfer sections to the horizontal transfer section;
a first wire, which is formed on the horizontal transfer section and connected to the driving electrodes, for light-shielding the horizontal transfer section, and
a colored on-chip lens layer which is formed in at least one of the region above the distribution transfer section and the region above the horizontal transfer section.
2. The solid-state image pickup device according to claim 1 , wherein the horizontal transfer section is light-shielded only by the first wire.
3. The solid-state image pickup device according to claim 2 , wherein the first wire is formed in an aluminum layer.
4. The solid-state image pickup device according to claim 1 , further comprising a second light shielding layer formed above the horizontal transfer section.
5. The solid-state image pickup device according to claim 2 , further comprising a second light shielding layer formed above the distribution transfer section.
6. The solid-state image pickup device according to claim 1 , further comprising a second wire formed above the horizontal transfer section.
7. The solid-state image pickup device according to claim 6 , wherein the second wire is formed in the second light shielding layer which is an aluminum layer.
8. The solid-state image pickup device according to claim 1 , wherein the distribution transfer section has a common pattern of electrodes for each n (n is an integer equal to or greater than 2) columns.
9. The solid-state image pickup device according to claim 1 , wherein the colored on-chip lens layer is a black on-chip lens layer.
10. A camera including a solid-state image pickup device, wherein
the solid-state image pickup device comprises:
a plurality of photo-detecting sections for generating signal charges;
a plurality of vertical transfer sections for transferring the signal charges in a vertical direction;
a horizontal transfer section for receiving the signal charges from the vertical transfer sections and transferring the received signal charges in a horizontal direction;
a distribution transfer section including a plurality of driving electrodes which are independently provided in a column direction in order to transfer the signal charges from the vertical transfer sections to the horizontal transfer section;
a first wire, which is formed on the horizontal transfer section and connected to the driving electrodes, for light-shielding the horizontal transfer section, and
a colored on-chip lens layer which is formed in at least one of the region above the distribution transfer section and the region above the horizontal transfer section.