Method for producing a reinforced durable electronic device, such as a plastic card, and the device obtained therefrom
View Patent ↗An electronic device, such as a mini card, has an inlay substrate for the electronic device. The inlay includes a substrate layer, a communication interface having a first metallization supported by the substrate layer, a hole or a hole location area, for attachment to an external device, and a second metallization surrounding at least partially the hole or its location area. The second metallization strengthens the card at the hole area. The method includes realizing the first and second metallizations on the same machine and/or at the same time.
1. An inlay substrate for an electronic device, comprising:
a substrate layer,
a communication interface supported by said substrate layer, said communication interface comprising a first metallization,
a hole or a hole location area, for attachment to an external device, and
a second metallization surrounding at least partially the hole or the hole location area without being disposed within the hole.
2. The inlay substrate of claim 1 , wherein said first and second metallizations are made of identical materials.
3. The inlay substrate of claim 1 , wherein said second metallization is selected from among a wire shaped electrical conductive material, an electrical conductive track, and an electrically conductive cord.
4. The inlay substrate of claim 1 , wherein said communication interface comprises at least an antenna coil formed by an electrically conductive wire, and the second metallization forms a wire ring comprising at least one wire turn.
5. The inlay substrate of claim 4 , wherein said ring comprises at least a first connection point between wire portions forming a closed ring.
6. The inlay substrate of claim 5 , further comprising:
an electronic microcircuit having electrical pads or terminals connected to the first metallization through at least a first connecting point,
at least a second connecting point closing the ring, said first and second connecting points being identical.
7. The inlay substrate of claim 6 , wherein said connection point is selected from among a welding, a joining through added conductive material, a seam or embroidery assembly.
8. An inlay substrate for an electronic device, comprising:
a substrate layer,
a communication interface supported by said substrate layer, said communication interface comprising a first metallization,
a hole or a hole location area, for attachment to an external device, and
a second metallization surrounding at least partially the hole or the hole location area without being disposed in the hole;
wherein the second metallization is selected from among a wire shaped electrical conductive material, an electrical conductive track and an electrically conductive cord.
9. An inlay substrate for an electronic device, comprising:
a substrate layer,
a communication interface supported by said substrate layer, said communication interface comprising a first metallization,
a hole or hole location area, for attachment for an external device, and
a second metallization surrounding at least partially the hole or the hole location area without being disposed in the hole;
wherein the second metallization is embedded in a portion of the substrate layer distinct from the hole.
10. The inlay substrate of claim 9 , wherein the first metallization is embedded in the substrate layer.