IP Library Granted Patent US 7,318,268
Granted Patent B2
US 7,318,268 · App. 11/606,939 · Granted Jan 15, 2008

Method for making flat antenna

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Quick Facts
Patent No.
US 7,318,268
App. No.
11/606,939
Granted
Jan 15, 2008
Kind
B2
Abstract

A method of making a flat-plate antenna having thinner shape and excellent productivity, reducing labor for installation in an electrical apparatus or on a wall, and exhibiting desired antenna characteristics stably. The method includes forming a conductive flat-plate having a slit portion, a radiating element portion, and a ground portion formed by press punching a lead-frame. The method also includes laminating over the lead-frame with a resinous film. The method further includes forming first and second connecting holes through which a part of the lead-frame is exposed. The method also includes press punching the laminated lead-frame including the slit portion, the radiating element portion and the ground portion. The method still further includes connecting first and second conductors of a power supply line with the radiating element portion and the ground portion, respectively.

Claims (6)

1. A method for manufacturing flat-plate antenna comprising the steps of:

forming a conductive flat-plate having a slit portion with width proportional to frequency band width, a radiating element portion disposed one side of said slit portion, and a ground portion disposed other side of said slit portion, said slit portion is formed by press punching through a lead-frame;

laminating over said lead-frame with a resinous film;

forming a first connecting hole through which a part of said lead-frame of said radiating element portion is exposed, and forming a second connecting hole through which a part of said lead-frame of said radiating element portion is exposed;

press punching said laminated lead-frame including said slit portion, said radiating element portion and said ground portion; and

connecting a first conductor of a power supply line with a part of said radiating element portion exposed through said first connecting hole, and connecting a second conductor of a power supply line with a part of said ground portion exposed through said second connecting hole.

Assignments (1)
MERGER Recorded Jan 29, 2014
From: HITACHI CABLE, LTD.
To: HITACHI METALS, LTD.
Reel/Frame 032134/0723 →