Method and system for extracting heat from electrical components
View Patent ↗A system for extracting heat from an electronic device is provided. The system includes heat dissipation means positioned within a printed circuit board to form an in-board heat sink structure and a fluid heat transfer medium disposed in the heat dissipation means. The medium circulates through the heat dissipation means carrying heat away from the electronic device.
1. A system for extracting heat from an electronic device, said system comprising:
an in-board heat sink structure positioned within a printed circuit board, said in-board heat sink structure comprising a microfluidic nano-tube system comprising a plurality of microfluidic nano-tubes;
a ball grid array package attached to said printed circuit board, said ball grid array package comprising a plurality of solder balls attached to corresponding contact pads, said contact pads attached to corresponding vias that extend from the corresponding solder balls through a dielectric plane in the printed circuit board to a copper plane, at least one microfluidic nano-tube of the plurality of microfluidic nano-tubes embedded within the dielectric plane between adjacent vias; and
a fluid heat transfer medium channeled through said in-board heat sink structure, wherein said fluid heat transfer medium flows into said in-board heat sink structure at a single entrance and circulates through said in-board heat sink structure carrying heat away from the electronic device.
2. A system in accordance with claim 1 further comprising a heat sink comprising at least one of a printed circuit board mounted heat sink, a metal frame mounted on said printed circuit board, and a heat sinking structure disposed on a structure separate from said printed circuit board.
3. A system in accordance with claim 1 wherein said in-board heat sink structure is located to maintain a minimum thermal distance between a via and an exterior surface of said in-board heat sink structure.
4. A system in accordance with claim 1 wherein said in-board heat sink structure is disposed directly under the ball grid array package.
5. A system in accordance with claim 1 wherein the heat is released into the ambient air using one of conduction and convection.
6. A system in accordance with claim 1 wherein said printed circuit board is fabricated from thermally conductive plastic and said plurality of microfluidic nano-tubes are fabricated from carbon fibers.
7. A system in accordance with claim 1 , wherein said plurality of microfluidic nano-tubes are connected such that said microfluidic nano-tube system forms a single continuous circuit through which said fluid heat transfer medium flows.
8. A method for extracting heat from an electronic device, the method comprising:
positioning an in-board heat sink structure within a printed circuit board, the in-board heat sink structure including a plurality of interconnected microfluidic nano-tubes;
attaching a ball grid array package to the printed circuit board, the ball grid array package comprising a plurality of solder balls attached to corresponding contact pads, the contact pads attached to corresponding vias that extend from the corresponding solder balls through a dielectric plane in the printed circuit board to a copper plane;
embedding at least one microfluidic nano-tube of the plurality of interconnected microfluidic nano-tubes within the dielectric plane between adjacent vias; and
channeling a fluid heat transfer medium through the in-board heat sink structure, wherein the fluid heat transfer medium enters the in-board heat sink structure through a single entrance and circulates through the in-board heat sink structure and into a heat sink.
9. A method in accordance with claim 8 further comprising positioning the heat sink with respect to the printed circuit board, the heat sink includes at least one of a printed circuit board mounted heat sink, a metal frame mounted on the printed circuit board, and a heat sinking structure disposed on a structure separate from the printed circuit board.
10. A method in accordance with claim 8 further comprising locating the plurality of microfluidic nano-tubes to maintain a minimum thermal distance between a via and an exterior surface of the plurality of microfluidic nano-tubes.
11. A method in accordance with claim 8 further comprising locating the in-board heat sink structure directly under the ball grid array package.
12. A method in accordance with claim 8 further comprising releasing the heat into the ambient air using one of conduction and convection.
13. A method in accordance with claim 8 wherein positioning the in-board heat sink structure comprises forming the plurality of microfluidic nano-tubes from carbon fibers within the printed circuit board that is fabricated from thermally conductive plastic.
14. A heat dissipation system comprising:
a microfluidic nano-tube system positioned within a printed circuit board, said microfluidic nano-tube system comprising a plurality of interconnected microfluidic nano-tubes;
a ball grid array package attached to said printed circuit board, said ball grid array package comprising a plurality of solder balls attached to corresponding contact pads, said contact pads attached to corresponding vias that extend from said corresponding solder balls through a dielectric plane in said printed circuit board to a copper plane, at least one microfluidic nano-tube of the plurality of interconnected microfluidic nano-tubes embedded within the dielectric plane between adjacent vias; and
a fluid transfer medium channeled through said microfluidic nano-tube system, wherein said fluid transfer medium flows into said microfluidic nano-tube system at a single entrance and circulates through said microfluidic nano-tube system and into a heat sink.
15. A system in accordance with claim 14 wherein said heat sink comprises at least one of a printed circuit board mounted heat sink, a metal frame mounted on said printed circuit board, and a heat sinking structure disposed on a structure separate from said printed circuit board.
16. A system in accordance with claim 14 wherein said microfluidic nano-tube system is located to maintain a minimum thermal distance between a via and an exterior surface of each of said plurality of interconnected microfluidic nano-tubes.
17. A system in accordance with claim 14 wherein the heat is released into the ambient air using one of conduction and convection.
18. A system in accordance with claim 14 wherein said printed circuit board is fabricated from thermally conductive plastic and each of said plurality of interconnected microfluidic nano-tubes is fabricated from carbon fibers.
19. A system in accordance with claim 14 wherein said printed circuit board is disposed directly under the ball grid array package.